Method for manufacturing ceramic / metal composite structure
A technology for a metal composite structure and a manufacturing method, which is applied to the composite structure formed by combining and its manufacturing field, can solve the problems of large thermal stress, decreased thermal dispersion ability, influence on reliability of high-power electronic parts, etc.
Inactive Publication Date: 2009-05-27
段维新
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Problems solved by technology
This thermal stress is very large, which has a great influence on the bonding strength (bonding strength) of alumina sheets and copper sheets, and after being packaged with electronic parts that generate heat, after tens of thousands of on-off cycles of electronic parts , if the bonding strength (combination strengt
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Abstract
The invention discloses a method for manufacturing a ceramic/metal composite structure. The manufacturing method comprises the following steps: carrying out multistage preoxidation treatment to a copper sheet; placing the copper sheet on a ceramic substrate; and heating the copper and the ceramic substrate to a combination temperature and carrying out combination treatment.
Description
technical field [0001] The invention relates to a manufacturing method of a ceramic / metal composite structure, in particular to a composite structure formed by combining an aluminum oxide layer and a copper layer and a manufacturing method thereof. Background technique [0002] When electrons flow in electronic parts, heat will be generated, and the heat generation will increase the resistance, hinder the flow of electrons, and then greatly affect the function of electronic parts. Under the current situation that the manufacturing technology of electronic parts is greatly improved, the line width in electronic parts is getting smaller and smaller, but the circuit density is getting higher and higher, so the heat generated by electronic parts is also increasing rapidly. Taking a computer's central processing unit (Central Processing Unit, CPU) as an example, the earliest version of Intel's Pentium only needs to be packaged with a heat dissipation power of 16W. However, the h...
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Inventor 段维新
Owner 段维新