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34results about How to "No cracking problem" patented technology

Film coating agent for extract medicament solid preparation and preparation method thereof

The invention relates to a film coating agent for an extract medicament solid preparation, which comprises the following components in parts by weight: 30-60 parts of hydroxypropyl methyl cellulose, 5-30 parts of plasticizer and 2-30 parts of stearic acid. The invention also relates to a preparation method of the film coating agent, which comprises the following steps of: (1) weighing the hydroxypropyl methyl cellulose, the plasticizer and the stearic acid in parts by weight; and (2) adding the hydroxypropyl methyl cellulose, the plasticizer and the stearic acid into a high-speed shearing machine and uniformly mixing the materials at the speed of 350-600 rpm to prepare a coating agent finished product. The coating agent is safe and non-toxic, and can form a hydrophobic molecular layer on the surface of a medicament for inhibiting the adsorption and osmosis of steam on the surface of a coating film, thereby reducing the moisture absorbing rate of a medicament coating tablet and preventing the damping and hardening of the medicament and medicament efficiency loss; meanwhile, the coating film has strong flexibility, and the coating quality is stable; and the preparation method has the outstanding advantages of high production efficiency, low energy consumption, favorable application performance of coating agent finished products, and the like.
Owner:TIANJIN BOKELIN MEDICINE PACKAGING TECH

Preparation method of filled baked wheaten cake

The invention relates to a preparation method of a filled baked wheaten cake and belongs to the technical field of food. The technical scheme is as follows: step one, 2 g of yeast is dissolved in water, the obtained solution is uniformly mixed with 400 g of flour, 10-30 g of vegetable oil and 60-70 g of eggs, the obtained mixture is mixed with water, and then kneading is carried out to form uniform and soft dough, and the dough is covered with a preservative film and fermented to be 2 times the size of the dough in a warm place; step two, filling is prepared; step 3, dough pieces in proper size are prepared from the fermented dough according to the preference, and wrappers which are thin on the periphery and thick in the middle are prepared with a rolling pin; step four, the wrappers are filled with the filling with closing openings facing downwards and then flattened by pressing; step 5, after a pot of cakes are prepared, the cakes can be properly rested for 10 min according to the degree of dough, oil is placed in an electric baking pan, the cakes are put and coated with oil, the electric baking pan is covered for baking, and turning can be conducted several times during baking;and step 6, the baked cakes are placed in a charcoal fire grill to be baked over charcoal fire until no oil layers exist on the surfaces. The purpose is achieved with the technical scheme.
Owner:WEIHAI GUANBIAO INFORMATION TECH

Film coating agent for extract medicament solid preparation and preparation method thereof

The invention relates to a film coating agent for an extract medicament solid preparation, which comprises the following components in parts by weight: 30-60 parts of hydroxypropyl methyl cellulose, 5-30 parts of plasticizer and 2-30 parts of stearic acid. The invention also relates to a preparation method of the film coating agent, which comprises the following steps of: (1) weighing the hydroxypropyl methyl cellulose, the plasticizer and the stearic acid in parts by weight; and (2) adding the hydroxypropyl methyl cellulose, the plasticizer and the stearic acid into a high-speed shearing machine and uniformly mixing the materials at the speed of 350-600 rpm to prepare a coating agent finished product. The coating agent is safe and non-toxic, and can form a hydrophobic molecular layer onthe surface of a medicament for inhibiting the adsorption and osmosis of steam on the surface of a coating film, thereby reducing the moisture absorbing rate of a medicament coating tablet and preventing the damping and hardening of the medicament and medicament efficiency loss; meanwhile, the coating film has strong flexibility, and the coating quality is stable; and the preparation method has the outstanding advantages of high production efficiency, low energy consumption, favorable application performance of coating agent finished products, and the like.
Owner:TIANJIN BOKELIN MEDICINE PACKAGING TECH

Method for manufacturing packaging product with metalized side wall

The embodiment of the invention discloses a method for manufacturing a packaging product with the metalized side wall. Metallization is conducted on the side wall after packaging is conducted, metallization can be conducted on the side wall without forming a groove in the process of manufacturing a substrate, and therefore manufacturing of the substrate is simplified. When the packaging process is conducted, due to the fact that the groove has not been formed in the substrate for metallization of the side wall, no special jig is needed when processing is conducted through the vacuum absorption technology, and therefore positioning is very easy to conduct, the packaging process is simplified, the process complexity of the packaging product with the metalized side wall is lowered, production cost is reduced, and work efficiency is improved. When the packaging process is conducted, the groove has not been formed in the substrate, the strength of the substrate is ensured, the problem of substrate cracking caused by improper force exertion can not occur, and therefore the product quality is ensured. In addition, due to the fact that the accuracy of groove forming in the packaging process is higher than the accuracy of groove forming in the substrate manufacturing process, the number of packaging substrate units which can be arranged on a strip is increased. In addition, machining of multi-electrode packaging products with the metalized side walls can be achieved through the method.
Owner:SKY CHIP INTERCONNECTION TECH CO LTD

Method for completing grain cutting of thin wafer by applying plasma grain cutting and laser equipment

PendingCN111446155AYellow light reduction processEfficient execution of the cutting processSemiconductor/solid-state device manufacturingLaser technologyLaser processing
The invention discloses a method for completing grain cutting of a thin wafer by applying plasma grain cutting and laser equipment. The method comprises the steps of adhering the front surface of an ultrathin wafer to a grain cutting frame; coating the upper end of the ultrathin wafer with a water-soluble or organic-soluble transparent polymer; using a laser technology to carry out laser processing on the transparent polymer , and cutting the polymer and the titanium / aluminum copper metal layer through to form a cutting channel pattern; carrying out a plasma process on the ultrathin wafer to cut crystal grains; using DI water / solvent for cleaning and removing polymers and metal impurities left in the laser process; and cutting the crystal grains on a UV type film frame. According to the invention, the coating water-soluble or organic-soluble transparent polymer is used, and a laser and path editing program process is applied, so that a sequence of yellow light processes is reduced; thetransparent polymer is aligned with the cutting channel, so that the cutting process is effectively implemented; and after the metal layer on the cutting channel is cut through by laser to form a polymer cutting channel pattern, the comprehensive plasma process is carried out to cut the crystal grains, and the wafer is not polluted.
Owner:绍兴同芯成集成电路有限公司

Glass sheet feeding mechanism

The invention discloses a glass sheet feeding mechanism which comprises a bed frame. A glass sheet containing and placement table, a horizontal guide rail, a sliding seat, an air cylinder, sliding rods and suction cups are arranged on the bed frame. The glass sheet locating and containing table is used for containing to-be-grabbed glass sheets. The horizontal guide rail is horizontally fixed abovethe glass sheet locating and placement table. The sliding seat is in sliding connection to the Y-direction guide rail. The air cylinder is fixed to the sliding seat and provided with an air cylindershaft stretching out vertically downwards. The lifting seat is connected with the air cylinder shaft of the air cylinder so as to be driven by the air cylinder to move up and down. The sliding rods vertically penetrate through the sliding seat and can slide up and down relative to the lifting seat. Limiting parts used for preventing the sliding rods from sliding out of the lifting seat downwards are arranged at the top ends of the sliding rods. The suction cups are connected to the lower ends of the sliding rods, and suction nozzles of the suction cups are vertically downward. The glass sheetfeeding mechanism solves the problem that the glass surface is scratched or broken when an existing feeding mechanism picks up glass.
Owner:ANHUI SHENGLI PRECISION MFG TECH CO LTD

A kind of thick copper circuit board processing method

The invention discloses a processing method of a thick copper circuit board. The processing method comprises the steps of etching a non-line graph area of the first surface of a copper plate, wherein the etching depth is 40% to 60% of the thickness of the copper plate, and the thickness of the copper plate is not less than 15 OZ; microetching the first surface of the copper plate, wherein the microetching depth is 20 to 30 micrometers; applying a layer of resin in a line graph area of the first surface of the copper plate; pressing a first insulating layer on the first surface of the copper plate, wherein the first insulating layer comprises an insulating core plate and a prepreg which is arranged between the insulating core plate and the first surface of the copper plate. According to the technical scheme of the processing method, burrs on a shoulder of a line after etching can be eliminated, so that the problem of cracks caused by mechanical squeezing of the burrs on glass fiber is avoided; a large quantity of bubbles remained in the resin can be avoided, so as to avoid layering or delamination caused the bubbles during subsequent pressing; the subsequent drilling difficulty can be reduced, and the breaking risk is reduced; the thickness uniformity of the obtained thick copper circuit board can be increased.
Owner:SHENNAN CIRCUITS

Motor vehicle frame structure

The invention provides a motor vehicle frame structure which is applied to the field of vehicle chassis parts. A front left hole (5) is formed in the front portion of a left longitudinal beam (1) of the motor vehicle frame structure, and a front right hole (6) is formed in the front portion of a right longitudinal beam (2); one end of a front cross beam (3) penetrates through the front left hole (5), and the other end of the front cross beam (3) penetrates through the front right hole (6); and a front left protruded block (31) arranged on the upper surface of the front portion of the left longitudinal beam (1) is arranged on the position, located above the front left hole (5), of the left longitudinal beam (1), and a front right protruded block (32) arranged on the upper surface of the front portion of the right longitudinal beam (2) is arranged on the position, located above the front right hole (6), of the right longitudinal beam (2). According to the motor vehicle frame structure, the structure is simple, the integral rigidity of a vehicle frame can be effectively improved, when large loads or impact are borne by the vehicle frame in the travelling process, the problems that thevehicle frame deforms, and welding joints crack can be avoided, the bearing capacity is effectively improved, and the safety accident is avoided.
Owner:WUHU XUEYING IND CO LTD

A kind of manufacturing method of sidewall metallization encapsulation product

The embodiment of the present invention discloses a sidewall metallization method, which performs sidewall metallization treatment after packaging, and does not require slotting for sidewall metallization during substrate fabrication, which simplifies substrate fabrication. During the packaging process, due to The substrate has not been slotted for sidewall metallization, so that no special fixture is needed for vacuum adsorption technology, and the positioning is very simple, which simplifies the packaging process, thereby reducing the process complexity and production cost of sidewall metallization packaging products, and improving Improve work efficiency; when performing the above packaging process, because the substrate has not been slotted, the strength of the substrate is guaranteed, and the problem of cracking of the substrate will not be caused by improper force during packaging, thereby ensuring product quality. The accuracy is higher than the slotting accuracy during substrate fabrication, and the number of packaged substrate units that can be laid out on the strip increases. In addition, the processing method of the present invention can realize the processing of multi-electrode side wall metallization products.
Owner:SKY CHIP INTERCONNECTION TECH CO LTD

Composite backboard of photovoltaic module

The invention discloses a composite backboard of a photovoltaic module, the composite backboard is in direct contact with a battery string layer, the composite backboard and the battery string layer are packaged into a whole through a lamination process, the composite backboard adopts a single-layer structure, and the raw material of the single-layer structure comprises a component A, a component B and a component C, wherein the component A comprises the following raw materials: polypropylene resin, a first polyester resin curing agent and chopped glass fibers; the component B comprises the following raw materials: polyester resin, a second polyester resin curing agent and chopped glass fibers; the raw material of the component C comprises EVA resin; the curing temperature of the polyester resin is higher than the melting point of the polypropylene resin; the temperature of the lamination process is higher than the curing temperature of the polyester resin; the composite backboard prepared by the invention has good water vapor barrier permeability, insulativity, flame retardance, weather resistance and deformation resistance, keeps good plastic processing performance and adhesion performance, does not need to be independently provided with an adhesive layer, and can be directly contacted and laminated with the battery string layer.
Owner:苏州通优新材料科技有限公司

Automobile frame structure

The invention provides an automobile frame structure applied to the field of automobile chassis parts. One end of a front cross beam (3) of the automobile frame structure penetrates through a front left hole (5), and the other end of the front cross beam (3) penetrates through a front right hole (6); front left triangular blocks (7) are welded to the positions of the inner side face of a left longitudinal beam (1) and one end of the front cross beam (3), and front right triangular blocks (8) are welded to the inner side face of a right longitudinal beam (2) and the other end of the front crossbeam (3); one end of a rear cross beam (4) penetrates through a rear left hole (9), and the other end of the rear cross beam (4) penetrates through a rear right hole (10); and rear left triangular blocks (11) are welded to the positions of the inner side face of the left longitudinal beam (1) and one end of the rear cross beam (4), and rear right triangular blocks (12) are welded to the inner side face of the right longitudinal beam (2) and the other end of the rear cross beam (4). The automobile frame structure is simple in structure and cannot deform when an automobile frame bears large load or impact during travelling, the problem of cracking of welding joint parts does not occur, and bearing capability is effectively improved.
Owner:WUHU XUEYING IND CO LTD

Preparation method and substrate of transparent single crystal Aln, ultraviolet light-emitting device

The invention discloses a method for preparing a transparent single crystal AlN, a substrate, and an ultraviolet light-emitting device, wherein the method for preparing a transparent single crystal AlN comprises: growing a sacrificial layer on an AlN single crystal substrate grown by a PVT method, the The sacrificial layer is: a conductive porous structure, a porous structure self-decomposed by thermal stress, or a polycrystalline buffer layer grown at low temperature; a single crystal AlN is grown on the sacrificial layer by HVPE; and the sacrificial layer is removed by electrochemical etching or laser lift-off , or directly use thermal stress to realize self-separation of the sacrificial layer, and obtain separated AlN single crystal substrate grown by PVT method and single crystal AlN grown by HVPE method. Only the thinner sacrificial layer needs to be simply removed, which is fast and effective, and at the same time avoids the oxidation problem caused by CMP, and the AlN single crystal substrate grown by the PVT method can be retained to realize recycling and effectively reduce the cost of transparent single crystal AlN substrate. The production cost of the bottom material. However, the single crystal AlN grown by HVPE method has high transmittance in the ultraviolet band, which is more suitable for the preparation of ultraviolet light-emitting devices.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

A composite backplane for photovoltaic modules

The invention discloses a composite backboard of a photovoltaic module. The composite backboard is in direct contact with battery strings, and is integrated with the battery strings through a lamination process. The composite backboard adopts a single-layer structure, and the raw materials of the single-layer structure Including mixed A component, B component and C component, wherein, the raw materials of A component include polypropylene resin, first polyester resin curing agent and chopped glass fiber; the raw materials of B component include polyester resin, The second polyester resin curing agent and chopped glass fiber; the raw materials of the C component include EVA resin; the curing temperature of the polyester resin is greater than the melting point of the polypropylene resin; and the temperature of the lamination process is greater than the curing temperature of the polyester resin; The composite backsheet prepared by the invention has good water vapor barrier properties, insulation properties, flame retardancy, weather resistance and deformation resistance properties, while maintaining good plastic processing properties and adhesive properties, without the need for a separate adhesive The adhesive layer can be directly laminated with the battery string layer.
Owner:苏州通优新材料科技有限公司
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