LCD module and method for measuring contact electric impedance between circuit boards therein

Abstract

An LCD module and a measuring method for the contact impedance between the circuit boards are provided. The LCD module includes a flexible circuit board, a printed circuit board, a first soldering and a second soldering pad. The flexible circuit board has a first conducting wire. The printed circuit board has the second conducting wire. The second conducting wire electrically connects with the first conducting wire. The first soldering pad electrically connects with the first conducting wire and the second soldering pad electrically connects with the second conducting wire. The first soldering pad and the second soldering pad are contacted for power supply to determine whether the second conducting wire electrically connects with the first conducting wire.

Description

Technical field [0001] The invention relates to a liquid crystal display module and a method for measuring the contact impedance between circuit boards, and more particularly to a structure for measuring the contact impedance between circuit boards in a liquid crystal display module. Background technique [0002] Generally, when making liquid crystal display modules, the printed circuit board (PCB) must be tightly pressed with the flexible printed circuit board (Flexible PrintCircuit; FPC) through conductive glue (such as: anisotropic conductive glue, referred to as ACF glue) , So that the signal can be smoothly transmitted between the printed circuit board and the flexible circuit board. [0003] However, it is known that the method of judging whether the two circuit boards are actually pressed together is only judged by the indentation between them or the amount of glue overflow, so the judgment result is often inaccurate. In addition, since the determination of the indentation...

AI Technical Summary

Problems solved by technology

[0003] However, the known method of judging whether the above two circuit boards are really pressed is only judged by the amount of indentation or overflow glue between them, so the judgment result is often not very accurate

In addition, because the determination of the amount of indentation or glue overflow often needs to be completed manually, it is impossible to use machines for automated inspection, and it is quite labor-intensive

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