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Processing apparatus and positioning method

A processing device and processing location technology, which is applied in the directions of transportation and packaging, conveyor objects, instruments, etc., can solve the problems of the corresponding difficulties of the transfer mechanism, and achieve the effect of reducing the workload and time of the operation.

Active Publication Date: 2009-06-03
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, the greater the deviation of the processing position in each vacuum processing chamber, the more difficult it is to respond to the teaching of the transfer mechanism.

Method used

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  • Processing apparatus and positioning method
  • Processing apparatus and positioning method

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Embodiment Construction

[0041] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Here, a multi-chamber plasma processing apparatus for etching a glass substrate for FPD (hereinafter simply referred to as "substrate") S will be described as an example. Here, examples of the FPD include a liquid crystal display (LCD), a light emitting diode (LED) display, an electroluminescence (Electro Luminescence; EL) display, a fluorescent display tube (Vacuum Fluorescent Display: VFD), a plasma display (PDP), and the like.

[0042] FIG. 1 is a perspective view showing an overview of a plasma processing apparatus, figure 2 is a horizontal sectional view showing its interior. Also, in Figure 1 and figure 2 Detail illustrations are omitted.

[0043] In this plasma processing apparatus 1 , a transfer chamber 20 and a load lock chamber 30 are connected to each other at the central portion. Around the transfer chamber 20, three processing chambers 10a, 10...

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Abstract

The invention provides a processing apparatus and positioning method, which can make alignment for accurate control of position of a substrate in a process chamber even if a plurality of process chambers are provided. In a load lock chamber 30, positioners 33a, 33b, 33c, and 33d are arranged for aligning a substrate S placed on buffers 31 and 32. A rectangular substrate S is pressed at four points by the abutment block 36 of the positioners 33a, 33b, 33c, and 33d, in the load lock chamber 30 for alignment in X-Y direction. The position is set for each process chamber, corresponding to processing position in each process chamber.

Description

[0001] This application is filed on May 16, 2006 , the application number is 200610080294.9 , the name of the invention is Processing device and alignment method divisional application of the patent application. technical field [0002] The present invention relates to a processing device and an alignment method. Specifically, it relates to a processing device and an alignment method used in the processing of objects to be processed such as glass substrates in the manufacturing process of flat panel displays (FPDs). Background technique [0003] As a vacuum processing apparatus for performing etching, polishing, film formation, etc., on a substrate as an object to be processed in a vacuum state in the FPD manufacturing process, a so-called multi-vacuum processing chamber equipped with a plurality of vacuum processing chambers for performing the aforementioned processing is used. Chamber vacuum treatment device. In this vacuum processing apparatus, a load lock chamber is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68H01L21/677H01L21/67H01L21/00G05B19/402
CPCH01L21/67069H01L21/67201H01L21/67236H01L21/67259H01L21/67721
Inventor 志村昭彦
Owner TOKYO ELECTRON LTD