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Apparatus and method for detecting open circuit defect by utilizing capacitive lead frame sensing

A defect, sensing board technology, applied in the direction of measuring devices, measuring electricity, measuring electrical variables, etc.

Inactive Publication Date: 2009-06-17
AGILENT TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] It can be seen that existing leadframe sensing technology is designed such that it can only detect continuity faults when the device pins are not shorted together by circuit components or the device itself

Method used

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  • Apparatus and method for detecting open circuit defect by utilizing capacitive lead frame sensing
  • Apparatus and method for detecting open circuit defect by utilizing capacitive lead frame sensing
  • Apparatus and method for detecting open circuit defect by utilizing capacitive lead frame sensing

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Embodiment Construction

[0016] Embodiments of the present invention will now be described with reference to the accompanying drawings.

[0017] image 3 A leadframe sensing measurement setup according to a first embodiment of the invention is shown. similar to figure 1 , image 3 The illustrated test setup 101 includes an AC source 102 , a sensing board 103 , a detector 104 , a buffer 105 and a ground 106 . A connector 107 (eg, a memory connector) has N pins 110 - 1 , 110 - 2 , . . . , 110 -N (N=9 in this example), and is mounted on the circuit assembly 108 . Thus, nine nodes 109-1, 109-2, . . . , 109-9 are formed between the pins of the connector and the circuit components. and figure 2 As shown similarly, the five nodes on the left are shorted together, which usually occurs on the "power node", as described above.

[0018] Those skilled in the art can understand that the connector here is just an example of electronic devices that can be installed on the circuit assembly. The invention can ...

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PUM

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Abstract

The invention provides a device for sensing and detecting open circuit defects by using capacitive lead frame and a method thereof. According to one aspect, the invention provides a device for detecting the open circuit defects on the nodes between pins formed on electronic devices and circuit components arranged on the electronic devices. The device comprises an AC source and a sensor board. The AC source exerts AC signals upon current tested nodes among the nodes; according to the arrangement of the electronic devices, the sensor board is divided into blocks, so that one block corresponds to each node. A detector measures signals at the blocks corresponding to the tested nodes; the signals are generated due to the capacitive coupling between the tested nodes and the corresponding blocks, and judges whether the open circuit defects exist at the tested nodes based on the measurement results.

Description

technical field [0001] The present invention relates generally to detecting electrical continuity, and more particularly to apparatus and methods for detecting open defects using capacitive lead frame sensing. Background technique [0002] One common defect that is often found during connectivity testing of integrated circuit assemblies is the "open circuit" defect. In an open defect, there is a lack of electrical connection between two points in a circuit between which there should be electrical connectivity. Opens are usually caused by problems in the manufacturing process, such as missing solder joints. Therefore, during the continuity test, connection defects such as disconnected solder joints need to be diagnosed. Detection of open defects is typically performed using known capacitive lead frame sensing techniques. [0003] figure 1 A prior art lead frame sensing measurement configuration is shown. figure 1 The illustrated test setup 101 includes an AC (alternating...

Claims

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Application Information

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IPC IPC(8): G01R31/02
Inventor 艾尔弗雷德·保利德尔
Owner AGILENT TECH INC