Structure for testing reliability analysis of integrated circuit inner layer dielectric

Abstract

The invention provides a testing structure for conducting reliability analysis to an inner dielectric of an integrated circuit, wherein, a metal wire adopted in the testing structure is in a straight line rod shape. The metal wire can be a plurality of metal lines which are in the straight line rod shape and connected with a dilated gasket respectively. The structure can completely avoid the situation that the test can not be carried out normally due to the easiness of burning down of the corners of the metal line when the voltage increases during the testing procedure. The structure can significantly reduce the possibility that the metal wire is burned down firstly in testing, thus facilitating the smooth implementation of the test and guaranteeing the accuracy of the test.

Description

Technical field [0001] The invention relates to a reliability analysis process in the semiconductor manufacturing industry, in particular to a boost test method, in particular to a circuit structure improved for the boost test of an inner layer dielectric. Background technique [0002] In the structure of integrated circuit devices, Inter Layer Dielectric (ILD) refers to the insulating layer between metals, generally composed of SiO 2 It is composed of other non-conductive materials, and its function is to isolate different circuit structures from each other. The properties of the inner dielectric are critical to the performance of the semiconductor device, and it is usually required to have good breakdown resistance. [0003] Vramp methodology can be used to test the performance of the inner layer dielectric. The main method of this method is to apply a constant stepped voltage to both ends of the inner layer dielectric. When the voltage rises to a certain level, the inner layer d...

AI Technical Summary

Problems solved by technology

[0009] For the circuit structure currently used for reliability analysis, in actual use, the metal wire pattern in the test structure is too small, and the metal wire has a zigzag corner shape, which causes the metal wire to be easily burned in the actual test, making the The problem that test can not carry out normally, proposes the present invention

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