Image capturing module, method for manufacturing the image capturing module, and electronic information device

An image capture and imaging technology, applied in image communication, radiation control devices, semiconductor/solid-state device manufacturing, etc., can solve problems such as weakening

Inactive Publication Date: 2009-07-29
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the influence of foreign objects

Method used

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  • Image capturing module, method for manufacturing the image capturing module, and electronic information device
  • Image capturing module, method for manufacturing the image capturing module, and electronic information device
  • Image capturing module, method for manufacturing the image capturing module, and electronic information device

Examples

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Embodiment 1

[0108] figure 1 is a longitudinal cross-sectional view of the basic structure of the image capture module in Embodiment 1 of the present invention.

[0109] exist figure 1 Among them, the image capture module 10 according to Embodiment 1 of the present invention includes: a holder member 1 as a dustproof box; a first focusing lens 2a and a second focusing lens 2b, which are vertically accommodated in the holder member 1; A light-shielding film 3 between the first focusing lens 2a and the second focusing lens 2b, a substrate 4; a sensor chip 5 provided on the substrate 4 as a solid-state image capturing chip; an infrared (IR) cut filter 6 , which is fixed on the first step portion 1d in the holder member 1, and is positioned across between the second focusing lens 2b and the sensor chip 5; and an adhesive portion 7, which is used to hold the holder member 1 The bottom surface of the outer sidewall and the substrate 4 are bonded.

[0110] The structure of the dustproof hold...

Embodiment 2

[0125] In Embodiment 1 as described above, a cartridge is described in which the height-direction position determining portion 1b of the holder member 1 with a flat surface is placed directly on the upper surface of the sensor chip 5 to accurately determine the position determination portion 1b fixed on the support. The distance between the lens of the sensor member 1 and the upper surface of the sensor chip 5 . In Embodiment 2, a case will be described in which the height-direction position determining portion 1b disposed on the upper surface of the sensor chip 5 has a pointed shape (circular or elliptical) instead of a flat surface shape.

[0126] Figure 4 is a longitudinal cross-sectional view of the basic structure of the image capture module in Embodiment 2 of the present invention.

[0127] exist Figure 4 Among them, the image capture module 10A according to Embodiment 1 of the present invention includes: a holder member 1A used as a dustproof box; a first focusing l...

Embodiment 3

[0132] In Embodiment 2 described above, the height-direction position determining portion (protruding portion) in a pointed shape (circular shape or elliptical shape) was described. In Embodiment 3, the number of point-shaped height-direction position determining portions will be described.

[0133] 5 is a plan view showing the positional relationship between the upper surface of the sensor chip and the height-direction position determining portion in the image capturing module according to the third embodiment of the present invention. Note that the continuation Figure 1-4 The reference signs in , the same reference signs represent parts with the same function or effect.

[0134]In FIG. 5 , the positional relationship between the upper surface of the sensor chip 5 and the three tips of the height-direction position determining portion is formed so that the three tips are positioned away from the image capturing area 5 a. The three tips of the position determining portion i...

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Abstract

An image capturing module according to the present invention includes a holder member, which accommodates therein a focusing lens for forming an image of a subject light on an image capturing chip attached on a substrate and is attached to the substrate to cover the image capturing chip, where the holder member is directly supported on a surface of the image capturing chip.

Description

[0001] This nonprovisional application is based on 35 U.S.C § 119(a) requirements of Japanese Patent Application No. 2007-297306 filed on November 15, 2007, Japanese Patent Application No. 2007-300976 filed on November 20, 2007 and 2008 Priority of Japanese Patent Application No. 2008-108373 filed on April 17, the entire contents of which are hereby incorporated by reference into this application. Technical field: [0002] The present invention relates to an image capture module having a modular (integrated) image capture element comprising a plurality of light receiving parts for photoelectric conversion and capturing image light from an object and a lens , the lens is used to form an image of incident light incident on an image capture element; the present invention also relates to a method of manufacturing an image capture module, and an electronic information device containing an image capture module, such as a digital camera (for example, a digital video camera and digita...

Claims

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Application Information

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IPC IPC(8): H04N3/15H04N5/335H01L27/146H01L21/50H01L21/82H04N5/225
Inventor 深町隆之广冈章吾
Owner SHARP KK
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