Encapsulation employing optical hardening glue

Abstract

The invention discloses a packaging method which uses light hardenable adhesive, including the following steps: a) at least one shield piece is arranged on the top surface of a substrate; the shield piece forms an accommodation space by surrounding; and a chip arranged on the substrate is located in the accommodation space; b) later, a light hardening adhesive layer which completely shields the chip is formed in the accommodation space; c) exposure and developing are used for leading the light hardening adhesive layer to be partially hardened, therefore, a hardened non-sacrificing part and a non-hardening sacrificing part can be defined; the sacrificing part is corresponding to the chip; and d) the sacrificing part is removed so as to cause one action area of the chip to be exposed in theoutside.

Description

technical field [0001] The present invention relates to semiconductors, in particular to a packaging method utilizing light curable glue. Background technique [0002] see Image 6 , which is a structural schematic diagram of a known packaging method; the known packaging method includes the following steps: a) firstly at least one shielding member 1 is arranged on the top surface of a substrate 2, and the shielding member 1 encloses to form an accommodating space 3, a The chip 4 disposed on the substrate 2 is located in the accommodating space 3; b) coating a light curable glue 5 on the top of the shield 1; c) covering the shield 1 with a light-transmitting cover 6 The top side is used to close the accommodating space 3; d) using exposure to harden the photocurable glue 5 to fix the shielding member 1 and the cover 6. [0003] However, the cover 6 is generally made of glass and is easily damaged due to external impact; in other words, this packaging method has a limited mec...

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Problems solved by technology

[0003] However, the cover 6 is generally made of glass and is easily damaged due to external shocks; in other words, this packaging method has limited mechanical strength in the overall structure and has the problem of not being able to protect the chip 4 reliably.

Furthermore, if the thickness of the cover 6 is increased in order to improve the mechanical strength of the cover 6, the operation performance of the chip 4 will be affected; in addition, if the thickness of the shield 1 is increased to improve the mechanical strength, it will be It will lead to the increase of the overall volume and the problem of increasing the cost

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