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Low-temperature matching co-firing method of ferrite and ceramic material

A technology of ceramic materials and ferrites, which is used in the field of low-temperature co-firing of ceramics and ferrites, and matching co-firing of heterogeneous materials. problem, to achieve the effect of improving low-temperature sintering densification characteristic parameters, reliability assurance, and low price

Inactive Publication Date: 2009-08-26
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

However, neither the solution of adding the intermediate layer nor the buffer layer can fundamentally solve the impact of the sintering mismatch; at the same time, due to the introduction of the intermediate layer or buffer layer material, it is difficult to know the exact electromagnetic parameters of the material, thus It is impossible to predict the electromagnetic performance of the manufactured device, which brings great inconvenience to production

Method used

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  • Low-temperature matching co-firing method of ferrite and ceramic material

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Embodiment Construction

[0014] Weigh 100.0g NiCuZn ferrite powder (self-made), solvent toluene 30.0g, ethanol 20.0g, dispersant 5.5g, plasticizer 0.7g, ball mill for 5 hours, add 33.0g of binder, ball mill for 8 hours, add 5wt% The BBSZ is matched with sintering aids, ball milled for 12 hours, after defoaming, cast, the film thickness is 25um, and it is ready for use.

[0015] Weigh 100.0g of ceramic powder (trade name: ULF140, purchased from Ferro, USA), solvent toluene 30.0g, ethanol 20.0g, dispersant 5.5g, ball mill for 5 hours, add 33.0g of binder, ball mill for 8 hours, after defoaming , casting, film thickness 25um, ready to use.

[0016] After debinding (400°C, 8h) to the ferrite slurry prepared in the above embodiment, ferrite powder containing 5wt% BBSZ was obtained. After granulation, pressing the standard ring, and sintering at 900°C for 6 hours, it was tested with Agilent4291B, and the results are shown in figure 2 . figure 2 (a) and (b) are the test data of real part and imaginary p...

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Abstract

A low-temperature matching co-firing method of ferrite and ceramic material belongs to the technical field of electronic components and relates to the low-temperature co-firing method (LTCC technology) of ceramics and the ferrite, in particular to the method for eliminating stress in the LTCC technology and realizing the matching co-firing of heterogeneous materials. The method controls the consistency of sintering densification characteristic parameters between the heterogeneous materials by adding BBSZ glass which is equal to 5 percent by weight of ferrite powder material in a tape-casting slurry formula of the ferrite as a matching co-firing assist agent, thereby realizing the matching sintering during the co-firing process. The method can effectively improve the low-temperature sintering densification characteristic parameters of the materials and realize the matching co-firing of the heterogeneous materials; meanwhile, the method has little effect on the electromagnetic property of the ceramics or the ferrite powder material. The method is characterized by simplicity, good operability, cheap prices, obvious effect and the like, thereby being capable of being widely used in the LTCC technology for producing various electronic components.

Description

technical field [0001] The invention belongs to the technical field of electronic components, and relates to a low-temperature co-firing method (LTCC technology) of ceramics and ferrite, in particular to a method for eliminating stress and realizing matching co-firing of heterogeneous materials in the LTCC technology. Background technique [0002] The emergence of multilayer low temperature co-fired ceramics and ferrite (Low Temperature Co-fired Ceramics and Ferrite-collectively referred to as LTCC) technology provides an ideal solution for system packaging. It is made of low-temperature sintered ceramic powder or ferrite powder into a green tape, on which the required circuit pattern is produced by drilling, filling, and precision conductive paste printing, and then laminated together. , After cutting and degluing, sintering at 900 ° C to make a high-density circuit that does not interfere with each other in three-dimensional space. Among them, the components embedded in t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/26C04B35/64C04B35/63
Inventor 李元勋刘颖力张怀武陈大明谢云松杨宗宝吴阳
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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