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Circuit substrate device and circuit substrate module device

A technology of circuit substrates and wiring substrates, which is applied in the direction of circuits, printed circuits, coupling devices, etc., can solve problems such as poor connection of anisotropic conductive parts such as open circuit or short circuit, and difficulty in curvature of circuit substrate devices, etc., to achieve low cost, The effect of suppressing initial investment and high stability

Inactive Publication Date: 2009-09-09
NEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And, with existing example 4 (referring to Figure 15 ), there is also the problem that poor connection such as open circuit or short circuit is likely to occur due to the restoring force of the anisotropic conductive member.
[0028] As described above, in the conventional connection structure of circuit boards that connect multiple wiring boards to each other, multiple wiring boards can be realized without causing poor electrical connections such as open circuits or short circuits, and without increasing product costs. The substrates are electrically connected to each other, and circuit substrate devices with curvature are difficult

Method used

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  • Circuit substrate device and circuit substrate module device
  • Circuit substrate device and circuit substrate module device
  • Circuit substrate device and circuit substrate module device

Examples

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Effect test

Embodiment approach 1

[0119] The circuit board device according to Embodiment 1 of the present invention will be described with reference to the drawings. figure 1 It is a process perspective view schematically showing the manufacturing process of the circuit board device in Embodiment 1 of this invention. figure 2 It schematically shows the manufacturing process of the circuit board device according to Embodiment 1 of the present invention. figure 1 A-A arrow cross-sectional view. image 3 It is (a) perspective view, (b) front view, (c) top view, (d) side view which schematically shows the structure of the anisotropic conductive member of the circuit board apparatus concerning Embodiment 1 of this invention before curved surface. Figure 4 It is a graph showing the relationship between the deflection amount δ1 and 6α of the rigidity ratio α=1 to 30 of the circuit board device according to Embodiment 1 of the present invention. in addition, figure 2 (a) Correspondence figure 1 (a), figur...

Embodiment approach 2

[0155] A circuit board device according to Embodiment 2 of the present invention will be described. In addition, since the drawings and the structures of the first wiring board 11 and the second wiring board 12 are the same as those of Embodiment 1, they are omitted here.

[0156] The circuit board device according to Embodiment 2 differs from Embodiment 1 in that a thermoplastic resin is selected as the shape-retaining resin 18 . Other structures are the same as those in Embodiment 1.

[0157] For the shape-retaining resin 18, for example, a thermoplastic polyethylene resin having a softening temperature of 105° C. can be used. In order to make the flexural rigidity Bp of the shape-retaining resin 18 10 times the flexural rigidity Bc of the insulating elastic resin material 16, the thickness of the shape-retaining resin 18 can be calculated using "Formula 5" and applied to 0.047mm thick. At this time, the elastic modulus of the insulating elastic resin material 16 of the a...

Embodiment approach 3

[0166] A circuit board device according to Embodiment 3 of the present invention will be described with reference to the drawings. Figure 5 , Image 6 It is a process perspective view schematically showing the manufacturing process of the circuit board device in Embodiment 3 of this invention. in addition Figure 5 (a) to (c) are diagrams relating to the process of imparting curvature to the anisotropic conductive member, Image 6 (a)-(b) are figures concerning an assembly process.

[0167] The circuit board device according to Embodiment 3 is a circuit board device having a structure in which a plurality of wiring boards are connected using an anisotropic conductive member, and includes a first wiring board 11 , a second wiring board 12 , and an anisotropic conductive member 15 .

[0168]The first wiring board 11 is a rigid printed wiring board in which metal wiring (eg, Cu wiring) is formed on a base material made of an insulating resin (eg, a resin mainly made of FR4). ...

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Abstract

Provided a circuit substrate device on which printed wiring substrates (11, 12) are electrically connected to each other by using an anisotropic conductive member (15) arranged between the printed wiring substrates (11, 12). The anisotropic conductive material (15) includes: an insulating elastic resin material (16); a metal fine lines (17) having an intermediate portion embedded in an insulating elastic resin material (16) so as to connect connection terminals (13, 14) corresponding to the printed wiring substrates (11, 12); and a resin layer (18) having a bending rigidity greater than the insulating elastic resin material (16). The printed wiring substrates (11, 12) and the anisotropic conductive material (15) are formed into an assembly having a curved surface. The resin layer (18) is a shape-keeping resin which keeps the curvature of the respective main surfaces of the anisotropic conductive member (15) matched with the curvature of the printed wiring substrates (11, 12).

Description

technical field [0001] (Related Application) This application claims the priority of the prior Japanese Patent Application No. 2006-284061 (filed on October 18, 2006), and the entire content of the above-mentioned prior application is incorporated herein by reference. [0002] The present invention relates to a circuit board device and a circuit board module device having a structure in which a plurality of wiring boards are electrically and mechanically connected to each other, and particularly relates to a circuit board device and a circuit board using an anisotropic conductive member as a connection medium Modular device. Background technique [0003] In the past, in portable telephone devices, PDA (Personal Digital Assistant) terminals, or many other electronic devices used in the field of electricity and communication, a plurality of printed wiring boards are installed, and these boards include: Flexible printed wiring boards, rigid printed wiring boards, etc., on whic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14
CPCH05K2201/09018H05K2201/10378H05K2201/0314H01R12/613H05K2201/2009H01R13/2414H01R12/52H05K3/368
Inventor 佐藤淳哉
Owner NEC CORP