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Microphone subassembly

A technology for microphones and components, applied in microphone structure associations, microphone ports/microphone accessories, transducer shells/cabinets/stands, etc., can solve the problem of not being directly used as a mobile phone microphone, etc., and achieve the effect of design flexibility

Inactive Publication Date: 2009-09-23
HIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, this patented technology cannot be directly used as a mobile phone, computer, personal digital assistant (PDA), voice over Internet protocol (VoIP) device, MP3 player, game console, headset, portable satellite navigation device (GPS), or other Microphones in similar electronic devices

Method used

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  • Microphone subassembly
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Examples

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Embodiment Construction

[0020] The implementation of the present invention is illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the invention from the content disclosed in this specification.

[0021] refer to Figure 1 to Figure 5 The first embodiment of the microphone assembly shown, the microphone assembly 1 of this embodiment, includes: a carrier board 11 having opposite first and second surfaces 111, 113, and a plurality of electrical connections on the second surface 113 Part 115; the microphone body 13 is arranged on the first surface 111 and is at least electrically connected to one of the plurality of electrical connection parts 115; and the electronic component 15 is arranged on the first surface 111 and is located on the microphone body 13, and at least electrically connected to one of the electrical connection parts 115.

[0022] The carrier board 11 is used to carry the microphone body 13 and electronic co...

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PUM

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Abstract

The invention discloses a microphone subassembly comprising a carrier plate, a microphone body and an electronic component, wherein the carrier plate is provided with a first surface and a second surface which are opposite and a plurality of electrical connection parts which are arranged on the second surface; the microphone body is arranged on the first surface and electrically connected with at least one of the electrical connection parts; and the electronic component is arranged on the first surface, positioned at one side of the microphone body and electrically connected with at least one of the electrical connection parts. The invention has the advantages that the microphone subassembly is modularized, thereby not only providing the transformation of sounds, but also overcoming the shortage that a microphone only has a sound transmitting function in the well-known art in such a way that the electronic component which is integrated into the microphone subassembly provides the transformation of light, action or reverse directions; and in addition, the electronic component is arranged according to the need of an applied electric device, thereby having more design flexibility.

Description

technical field [0001] The invention relates to a microphone assembly, in particular to a modular microphone assembly. Background technique [0002] For devices that need to transmit sound, such as mobile phones, computers, personal digital assistants (PDAs), Voice over Internet Protocol (VoIP) devices, MP3 players, game consoles, headsets, portable satellite navigation devices (GPS), or For other similar electronic devices, the use of microphones is the most common technology. [0003] At the same time, in order to improve the sound processing performance of the microphone, it usually focuses on effectively suppressing noise, removing wind noise, eliminating echo, meeting miniaturization and high power requirements, etc. as the focus of technological development. Therefore, related technologies include, for example, China Taiwan Patent Certificate No. 1279155 Invention Patent, China Taiwan Patent Certificate No. 1298984 Invention Patent, China Taiwan Patent Certificate No....

Claims

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Application Information

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IPC IPC(8): H04R1/08H04R1/04
Inventor 张家庆潘俊弟朱朔鸿
Owner HIT
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