Carrier for transmitting high-frequency signal and carrier wiring method

Abstract

The invention provides a carrier for transmitting high-frequency signal and a carrier wiring method. The carrier comprises a substrate, a signal wire and a reference plane which are formed on the substrate. The carrier wiring method is as follows: defining the impedance and thickness of the carrier according to the transmitted high-frequency signal, and defining the wiring parameters according tothe impedance and thickness, the wiring parameters include forming a conducting layer on the signal wire, forming coplanar waveguide between the reference plane and the signal wire, forming a coarse part on the signal wire, forming a reduction part on the signal wire, and selecting high tangent loss substrate, and the wiring is carried out according to the defined wiring parameters to improve theloss of the transmitted high-frequency signal.

Description

technical field [0001] The invention relates to a signal transmission technology, in particular to a carrier for transmitting high-frequency signals and a carrier wiring method. Background technique [0002] The data transmission speed of communication products is continuously increasing. In order to maintain the transmission quality of high-frequency signals, the line width must be consistent in the design of carriers such as circuit boards, cables, and flexible circuit boards. When transmitting electronic signals between signal wires, ensure the integrated matching of characteristic impedance (Characteristic impedance). [0003] At the same time, without affecting the basic rise time, fall time, clock, jitter, and eye diagram of high-frequency signals, the aforementioned communication products can usually use flexible printed circuit boards (Flexible Printed Circuit Board, Flexible PCB) or soft and hard boards. (Flex-rigid PCB) and other flexible circuit boards are used a...

AI Technical Summary

Problems solved by technology

[0007] However, the low-pass filter will greatly increase the chip area, and under the process variation, the delay time such as the delay unit is difficult to control and lacks flexibility

At the same time, since capacitors and resistors occupy a large area in the integrated circuit, they are also essential components of the filter, so the low-pass filter will inevitably greatly increase the chip area.

Moreover, the delay time of the delay unit will produce errors due to process variations, which are difficult to control during design, so that not only may affect performance, but may even affect system stability

In addition, under such a design, the delay time is fixed and inflexible. For input signals of different frequencies, it may not be able to match the delay time, which will affect the stability of the system.

[0008] Furthermore, when choosing a material that is less likely to cause signal attenuation as the substrate, the lower dielectric constant and smaller dielectric loss can suppress the loss of high-frequency signals; however, this substrate has a number of uses. Disadvantages of fewer and more expensive

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