Assembly method of sidelight-type backlight module

An assembly method and technology of a backlight module, which are applied in the cooling/heating device, optics, light guide and other directions of lighting devices, can solve the problems of thermal coupling and mutual heat accumulation, and achieve the effect of increasing the divergence path and improving the efficiency.

Inactive Publication Date: 2009-10-14
AU OPTRONICS CORP
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Problems solved by technology

In this way, not only the problem of heat dissipation cannot be solved, b

Method used

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  • Assembly method of sidelight-type backlight module
  • Assembly method of sidelight-type backlight module
  • Assembly method of sidelight-type backlight module

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Embodiment Construction

[0054] figure 1 When the light guide plate 13 in the backlight module 1 is assembled into the backlight module 1, there is often a gap A between it and the LED 121. Theoretically speaking, the smaller the value of the gap A, the better, and it is best not to have it at all, so that the light guide plate 1 is as close as possible. The LED 121 can provide higher utilization efficiency of the light source and also avoid light leakage. However, the size design of the general frame always reserves some tolerance margins to match the actual processing or assembly tolerances; therefore, the existence of the gap A is difficult to avoid in actual situations. Therefore, in addition to the above-mentioned problem of poor heat dissipation, the known side-light LED backlight module also has the problem that the light incident efficiency needs to be improved.

[0055] Please refer to Figure 2A , which is a side sectional view of an edge type (Edge type) backlight module disclosed in the ...

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Abstract

The invention relates to an assembly method of a sidelight-type backlight module, comprising the steps: a first heat-conductive structure is provided, the first heat-conductive structure consists of a first body part and a first extension part connected with the first body part, a first LED light source group and a light guide plate are fixed on the first heat-conductive structure with the shiny surface of the first LED light source group closely fitted to the first incident surface of the light guide plate; a frame is provided, which is provided with a bottom and a first side wall extending upwards from one side of the bottom; the light guide plate, the light source group and the heat-conductive structure which are fixed together are assembled in the frame so that the first LED light source group is arranged at one end of the frame adjacent to the first side wall, the first heat-conductive structure is arranged between the first LED light source group and the frame, the first body part is arranged between the first LED light source group and the first side wall, and the first extension part extends between the first LED light source group and the bottom and between the light guide plate and the bottom, thereby solving the problem that a gap between the light guide plate and the LED light source group is oversize, ensuring utilization efficiency of the light source and preventing light leakage phenomenon.

Description

[0001] This application is a divisional application of an invention patent application whose applicant is AU Optronics Co., Ltd., with an application date of March 9, 2007, an application number of 200710085894.9, and an invention title of “A Side-light Backlight Module”. technical field [0002] The invention relates to an assembly method of a backlight module, in particular to an assembly method of an edge type (Edge Type) backlight module with a heat dissipation device. Background technique [0003] Liquid crystal display (LCD) technology is widely used in computer screens, mobile phones, digital cameras, camcorders, PDAs and other products. LCD panel (LCD panel) is a key display component, but it does not emit light by itself. It needs to be equipped with a backlight module (backlight module) to display. The backlight module is assembled with the LCD panel to form a complete LCD module ( liquid crystal module, LCM). [0004] Please refer to figure 1 , figure 1 It is a...

Claims

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Application Information

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IPC IPC(8): F21S8/00F21V17/00F21V29/00F21V8/00F21V19/00G02F1/13357F21Y101/02F21V29/503F21V29/70G02F1/1335
Inventor 林佑撰
Owner AU OPTRONICS CORP
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