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Electronic device with dual function outer surface

A technology for electronic devices and outer surfaces, which can be used in telephone structures, electrical digital data processing, instruments, etc., and can solve problems such as uncomfortable heat

Inactive Publication Date: 2009-10-21
SONY ERICSSON MOBILE COMM AB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under certain circumstances, electronic devices and especially heat sink surfaces can become uncomfortably hot for the user

Method used

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  • Electronic device with dual function outer surface
  • Electronic device with dual function outer surface
  • Electronic device with dual function outer surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The following detailed description of the invention refers to the accompanying drawings. The same reference numbers in different drawings may identify the same or similar elements. Also, the following detailed description does not limit the present invention.

[0031] As described herein, the exterior of an electronic device is given an uneven profile, such as a contoured profile, to aid in heat dissipation. High points in an uneven profile, such as peaks in a wavy profile, can be stamped or coated with a thermally non-conductive coating. The thermally non-conductive coating is relatively comfortable for the user to touch. In this way, the uneven profile of the electronic device serves to dissipate heat while allowing the user to comfortably touch or hold the device.

[0032] Figure 1A and Figure 1B A front view and a rear view of the exemplary electronic device 100 are shown respectively. In this example, the electronic device 100 is a mobile terminal. More gen...

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PUM

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Abstract

An outer portion of an electronic device has an uneven profile to aid in the dissipation of heat. Raised points in the uneven profile may be manufactured with a non-thermal conductive coating. In one implementation, the outer portion of the device includes a thermally conductive layer having an uneven surface and at least one other surface that is thermally coupled with a heat source. The uneven surface includes high areas that are higher than other areas of the uneven surface. A number of non-thermally conductive second layer areas are located on the high areas of the thermally conductive surface.

Description

technical field [0001] Embodiments described herein relate generally to electronic devices and, more specifically, to heat dissipating surfaces of electronic devices. Background technique [0002] As technology reduces the size and increases the computing power of such electronic devices such as mobile phones, media players, navigation devices, laptops and handheld computers, the use of such electronic devices has become increasingly more common. All electronic devices require power to operate, and some power is dissipated as heat. [0003] Heat sinks can be used in electronic devices to help dissipate heat into the ambient atmosphere. Under certain circumstances, electronic devices, and particularly heat sink surfaces, can become uncomfortably hot for a user. Contents of the invention [0004] According to one aspect, a device has an outer surface and includes a thermally conductive layer and a second layer region. The thermally conductive layer has an uneven surface ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H04M1/02G06F1/16
CPCH05K5/02G06F1/203H05K5/0209H05K7/20418
Inventor K·尼尔森M·休戈森A·赖登T·卡尔利德F·范图T·塔卡莫托
Owner SONY ERICSSON MOBILE COMM AB