Semi-conductor luminescence component
A technology of light-emitting components and semiconductors, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems affecting the heat dissipation efficiency of high-power LEDs, affecting work performance, etc., to achieve the suppression of thermal interference transfer and optimal heat dissipation efficiency effect
Inactive Publication Date: 2012-11-21
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
Under this setting, although the silicon substrate can conduct and dissipate the heat generated when the high-power LEDs emit light, but because the multiple high-power LEDs are densely arranged on the silicon substrate, there will be heat generated between the LEDs that are closer to each other. Obvious thermal interference transfer, which seriously affects the heat dissipation efficiency of high-power LEDs, thereby affecting their working performance
Method used
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Embodiment Construction
[0012] Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0013] see figure 1 , a semiconductor light-emitting component 10 provided by an embodiment of the present invention, which includes: a substrate 11 , a plurality of metal pad layers 12 and a plurality of light-emitting diode dies 13 .
[0014] The substrate 11 is used to carry the reference figure 2 , the substrate 11 has a first surface 110 , a second surface 112 and a plurality of side surfaces 114 . The first surface 110 is opposite to the second surface 112 . The side surface 114 is in contact with the first surface 110 and the second surface 112 respectively, and is arranged at an angle other than 90 degrees with the first surface 110 and the second surface 112 . The first surface 110 of the substrate 11 is provided with a plurality of grooves 116 recessed toward the second surface 112 , and the plurality of grooves 116 divide the fir...
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The invention provides a semi-conductor luminescence component, which comprises a substrate, a plurality of LED crystal grains arranged on the substrate, and a plurality of metal cushion layers, wherein the substrate is provided with a first surface and a second surface opposite to the first surface; the first surface of the substrate is provided with a plurality of grooves sinking to the second surface, and the plurality of the grooves divide the first surface of the substrate into a plurality of discontinuous regions; and each of the plurality of the discontinuous regions is provided with two metal cushion layers which are separated from each other and one LED crystal grain which is electrically connected with the two metal cushion layers. The semi-conductor luminescence component can effectively inhibit the transmission of the thermal disturbance among the LED crystal grains, and has better radiating efficiency.
Description
technical field [0001] The invention relates to a semiconductor light-emitting component, in particular to a semiconductor light-emitting diode component with better heat dissipation efficiency. Background technique [0002] Light-emitting diodes (LEDs, LightEmitting Diodes) made of semiconductor light-emitting components have the advantages of high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, and long life, so they can be widely used as light sources for lighting. In the field, please refer to the article Thermal Considerations for LED Components in an Automotive Lamp by Joseph Bielecki et al. in the 23rd IEEE SEMI-THERM Symposium. [0003] In a specific lighting environment, in order to increase the brightness of a miniaturized LED lighting device, it is often necessary to integrate multiple high-power LEDs on a tiny substrate. However, considering that LEDs require higher heat dissipation efficiency, th...
Claims
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IPC IPC(8): H01L25/00H01L25/075H01L23/488H01L23/13H01L23/367
CPCH01L2924/0002
Inventor 张仁淙
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD