Technical method for multilayer glue dispensing in production process of EMI product

A technology of production process and process method, applied in the direction of coatings, devices for coating liquid on the surface, electrical components, etc., can solve the problems of low production efficiency and high production cost, and achieve improved production efficiency, reduced labor costs, and reduced production The effect of links and people

Inactive Publication Date: 2009-12-23
TIANJIN LAIRD TECH LTD
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To achieve this goal, the more common way is to meet the customer's high aspect ratio requirements by bonding, which requires additional adhesives and bonding processes, and the production efficiency is relatively low and the production cost is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Technical method for multilayer glue dispensing in production process of EMI product
  • Technical method for multilayer glue dispensing in production process of EMI product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0019] Embodiment: a kind of process method of multi-layer dispensing in EMI product production process (see figure 2 ), characterized in that it comprises the following steps:

[0020] (1) Place the substrate to be dispensed on the jig prepared in advance;

[0021] (2) Use the viscosity of the conductive adhesive itself to directly realize the bonding and fusion of the adhesive strip and the adhesive strip,

[0022] Adjust the dispensing program so that the dispensing machine runs more than two times in one program, including two times; there should be differences in the initial height during the two runs, and the total height of the glue strip structure of the dispensing layer is 2h*K; where h is the layer height of the single-layer rubber strip; K is the correction coefficient of the dispensing layer height determined by the thixotropy of the conductive adhesive, K=R h / w *k`; when n=2, 0.9 n-1 Then k`=0.9;

[0023] (3) Complete the first layer of dispensing of the prod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a technical method for multilayer glue dispensing in the production process of an EMI product, which comprises the following steps: (1) placing a substrate needing glue dispensing on a jig which is made in advance; (2) adjusting glue dispensing programs to enable a glue dispenser to run two times or more in one program; (3) according to a glue dispensing route, completing first layer glue dispensing of the product; (4) according to the glue dispensing route, completing second layer glue dispensing of the product; (5) according to the glue dispensing route, completing next layer glue dispensing needed by the product; and (6) transferring the product from the jig to a vulcanizing chamber for vulcanization of the product to obtain a glue dispensing product which has more than two layers and of which the height-width ratio meets the requirement. The technical method has the advantages that the method directly realizes the bonding and fusion among adhesive tapes by using the viscosity of conductive adhesive, improves the production efficiency and reduces the labor cost.

Description

(1) Technical field: [0001] The invention relates to a dispensing process in the application field of electrostatic shielding of electronic components, in particular to a process method for multi-layer dispensing in the production process of EMI products (two) background technology: [0002] Dispensing technology is widely used in the production of EMI products, but the dispensing technology is single-layer dispensing, so the aspect ratio of the product strip using conductive adhesive is seriously affected by the thixotropic properties of the conductive adhesive itself. With the deepening of the application, more and more applications require the adhesive strip to achieve a larger aspect ratio, that is, more than 80% or even more than 100%. To achieve this goal, the more common way is to meet the customer's high aspect ratio requirements by bonding, which requires additional adhesives and bonding processes, and the production efficiency is relatively low and the production c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B05D1/36B05D3/10B05D7/24H05K9/00
Inventor 刘东顺
Owner TIANJIN LAIRD TECH LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap