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Method for forming chip encapsulating lug structure of flexible convex pad

A chip packaging and flexible technology, applied in the field of forming bump structures of flexible bump pad chip packaging, can solve the problems of complex process, increase the complexity of bump process, failure, etc., and achieve the effect of simplifying the process

Active Publication Date: 2011-04-20
JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] (1) Chip resistance to stress is poor
[0006] The bump has relatively high rigidity as a whole. When subjected to stress, it is difficult for the barrier layer, seed layer, and electroplated metal layer to absorb and buffer the stress through deformation, which may easily cause the chip bump or chip to break and fail
[0007] (2) The process is complicated
[0008] Due to the need to use the bump plating process, the complexity of the entire bump process is increased

Method used

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  • Method for forming chip encapsulating lug structure of flexible convex pad
  • Method for forming chip encapsulating lug structure of flexible convex pad
  • Method for forming chip encapsulating lug structure of flexible convex pad

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Experimental program
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Embodiment Construction

[0023] The packaging bump structure of the flexible bump pad chip of the present invention is mainly composed of a chip body 1 , a chip electrode 2 , a chip surface protection layer 3 , a flexible bump pad 4 , a transition layer 5 and solder balls 6 . The chip electrode 2 is embedded on the chip body 1, the chip surface protection layer 3 is compounded on the surface of the chip body 1 and the outer periphery of the chip electrode 2 surface, and the middle part of the surface of the chip electrode 2 exposes the chip surface protection layer 3, the flexible The bump pad 4 is arranged on the middle part of the surface of the chip electrode 2 and the surface of the chip surface protective layer 3 at the joint position with the middle part of the surface of the chip electrode 2, and the transition layer 5 is compounded on the flexible bump pad 4, so The solder balls 6 protrude upward and are disposed on the transition layer 5 .

[0024] The transition layer 5 completely or partial...

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Abstract

The invention relates to a method for forming a chip encapsulating lug structure of a flexible convex pad, which belongs to the technical field of chip encapsulating. The method comprises the following technological process that flexible convex pads are arranged on the middle part of the surface of a chip electrode and the surface of a chip surface protective layer in the connecting position of the middle part of the surface of the chip electrode; then, a transition layer is compounded on the flexible convex pads; finally, welding balls are arranged on the transition layer in an upward protrusion way. On the premise of not affecting the electric property, the chip encapsulating lug structure of a flexible convex pad formed by the method can play the roles of absorption and buffer on the suffered stress. The method has simple technology.

Description

(1) Technical field [0001] The invention relates to a method for forming a bump structure packaged by a flexible bump pad chip. It belongs to the technical field of chip packaging. (2) Background technology [0002] With the development of chip packaging technology, many types of chip packaging bumps have emerged, such as solder ball bumps, copper pillar bumps, and the like. [0003] The structure of this type of packaging bump has the following characteristics: on the chip electrode is a barrier layer and a seed layer with a thickness of several hundred nanometers, on the barrier layer and the seed layer is an electroplated metal layer of several microns to tens of microns, and on the electroplated metal layer are solder balls. This type of chip packaging bump is basically formed by the following methods in sequence: sputtering a metal barrier layer and a seed layer on the chip, coating photoresist on the seed layer, opening a window on the photoresist, and electroplating...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L21/56H01L23/482H01L23/488H01L23/28
CPCH01L24/11H01L2224/11H01L2924/00012
Inventor 陈栋张黎赖志明陈锦辉曹凯
Owner JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD