Method and device for connecting optical transceiving device with printed circuit board (PCB)

Abstract

The invention discloses a method and a device for connecting an optical transceiving device with a printed circuit board (PCB), and is applicable to a pluggable photoelectric module. The method comprises the following steps of arranging a metalized groove on the position where the bottom layer of the PCB is interfered with a pin mounted at the lower side of the optical transceiving device; manufacturing a connecting plate for connecting the optical transceiving device and the PCB; when the connecting plate is connected with the top layer of the PCB, the distance between a bonding pad of the connecting plate and the metalized groove of the PCB is equal to that of the pin mounted at the upper side of the optical transceiving device and the pin mounted at the lower side of the optical transceiving device; the connecting plate is welded on the top layer of the PCB; the pin mounted on the upper side of the optical transceiving device is correspondingly welded with the bonding pad of the connecting plate; the pin mounted at the lower side of the optical transceiving device is correspondingly welded with the metalized groove of the PCB. By adopting the technical scheme in the invention, clubfoot shaping for the optical transceiving device can be avoided, the optical transceiving device is not damaged easily, the operation is simple and the connection is reliable.

Description

technical field [0001] The invention relates to the technical field of pluggable photoelectric modules, in particular to a method and device for connecting an optical transceiver and a printed circuit board. Background technique [0002] The pluggable photoelectric module is a standardized product widely used in optical communication systems to realize photoelectric conversion. The pin definition, structural size and other parameters of this type of product are stipulated by the multi-protocol developed by the multi-protocol committee for miniaturized transceivers (such as: SFP MSA). The position of the golden finger of the main printed board of the pluggable optoelectronic module and the position of the optical axis of the optical transceiver device are stipulated in the multiple agreement, but due to the plane of the golden finger of the main printed board of the pluggable optoelectronic module and the optical axis of the optical transceiver device The horizontal planes a...

AI Technical Summary

Problems solved by technology

This method not only has low production efficiency and poor product consistency, but also because the pins of the optical transceiver device are fixed in a fragile glass package, bending the pins is very easy to damage the glass body, resulting in cracks, resulting in damage to the airtightness of the optical device , leading to a decrease in the service life of the optical device chip

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