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Illuminating device and its manufacturing method

A lighting device and substrate technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of light yellow, broken balance between luminous amount and yellow phosphor, and failure to obtain luminous amount, and achieve vibration resistance and durability Excellent thermal properties and the effect of increasing the amount of light emitted

Inactive Publication Date: 2010-02-03
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that part of the light emitted from the light emitting diode 101 is absorbed by the insulating resin film 110e, and the light emission amount as designed cannot be obtained.
[0006] In addition, the amount of the yellow phosphor filled in the concave portion 114c is adjusted to an optimum amount with respect to the amount of light emitted by the light emitting diode 101. However, if the amount of light emitted as designed cannot be obtained as described above, the amount of light emitted and the amount of the yellow phosphor The balance of quantity is broken, and the luminous color may change from white to light yellow

Method used

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  • Illuminating device and its manufacturing method
  • Illuminating device and its manufacturing method
  • Illuminating device and its manufacturing method

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no. 1 Embodiment approach

[0044] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. figure 1 It is a schematic plan view showing the lighting device of this embodiment. figure 2 With figure 1 The schematic diagram of the cross-section corresponding to the A-A' line. image 3 yes figure 2 The enlarged cross-sectional schematic diagram of . In addition, these figures are for explaining the structure of the lighting device of this embodiment, and the size, thickness, dimension, etc. of each part shown in illustration may differ from the dimensional relationship of an actual lighting device.

[0045] Such as Figure 1 ~ Figure 3 As shown, the lighting device 1 of the present embodiment is roughly composed of a base 5 in which a base substrate (base base) 2 and a cover member 3 are integrated, and a semiconductor light emitting element 6 (hereinafter referred to as a light emitting element). Base substrate 2 and cover member 3 are integrated v...

no. 2 Embodiment approach

[0078] Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. Figure 5 It is a schematic cross-sectional view showing main parts of the lighting device according to the present embodiment. in addition, Figure 5 and Figure 1 ~ Figure 3 Similarly, it is a diagram for explaining the configuration of the lighting device according to the present embodiment, and the size, thickness, dimension, etc. of each part shown in the illustration may differ from the actual dimensional relationship of the lighting device.

[0079] In addition, the lighting device of this embodiment differs from the lighting device of the first embodiment in that a metal reflection film is formed on the end surface (light reflection portion) of the metal layer exposed on the side wall surface of the concave portion. Therefore, the following description will focus on the differences between the present embodiment and the first embodiment. Also, yes in ...

no. 3 Embodiment approach

[0086] Next, a third embodiment of the present invention will be described with reference to the drawings. Figure 6 is a schematic cross-sectional view showing the lighting device of the present embodiment, Figure 7 yes Figure 6 magnified view of . in addition, Figure 6 and Figure 7 and Figure 1 ~ Figure 3 Similarly, it is a diagram for explaining the configuration of the lighting device according to the present embodiment, and the size, thickness, dimension, etc. of each part shown in the illustration may differ from the actual dimensional relationship of the lighting device.

[0087] In addition, the lighting device of this embodiment differs from the lighting device of the first embodiment in that a light reflective metal film is formed on the side wall surface 4b of the concave portion 4 including the end surface 8a of the metal layer 8 . Therefore, the following description will focus on the differences between the present embodiment and the first embodiment. ...

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Abstract

An illuminating device is provided with a substrate where a base substrate formed of an inorganic insulator is bonded to a cover member through a bonding metal layer, and with a semiconductor light emitting element fitted to the substrate. A recess is formed on one face of a cover member-side in the substrate and the semiconductor light emitting element is stored in the recess. An end face of themetal layer is arranged in a region confronted with the semiconductor light emitting element in side wall faces of the recess. A light reflecting part reflecting radiation light of the semiconductor light emitting element is constituted of the end face.

Description

technical field [0001] The present invention relates to a lighting device and a method for manufacturing the lighting device. [0002] This application claims priority based on Japanese Patent Application No. 2007-124618 for which it applied in Japan on May 9, 2007, and uses the content here. Background technique [0003] Conventionally, lighting devices using light-emitting diodes as light sources have been developed as substitutes for various light bulbs, discharge tubes, and the like. Light-emitting diodes have a large amount of light compared to power consumption and are less prone to failure, so they are widely studied not only as light sources for household use but also as light sources for vehicles. [0004] For example, Patent Document 1 below discloses a light-emitting diode lamp (illumination device) roughly composed of a plurality of light-emitting diodes, a mounting substrate on which these light-emitting diodes are mounted, and a cover plate. exist Figure 10 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/50H01L33/56H01L33/60H01L33/62
CPCH01L2924/0002H01L33/486H01L33/62H01L33/60H01L2224/16H01L2224/05573H01L2224/05568H01L2924/00014H01L2224/0554H01L2224/16227H01L2224/05599H01L2224/0555H01L2224/0556
Inventor 安田刚规
Owner SHOWA DENKO KK