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Reinforced method of internal memory

A memory and memory slot technology, applied in the direction of digital processing power distribution, etc., can solve problems affecting the normal use of equipment, damage, poor memory contact, etc., and achieve good promotion and use value, convenient use, and good contact effects

Inactive Publication Date: 2010-02-17
SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the ruggedized devices are in high vibration, shock, salt spray and humid environments, the memory often has poor contact and damage, which seriously affects the normal use of the device

Method used

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  • Reinforced method of internal memory
  • Reinforced method of internal memory

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Experimental program
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Embodiment

[0023] A memory reinforcement method of the present invention comprises a main board 2, a main board fixing frame 1, and a memory 4, the memory 4 is fixed on the main board 2 through a memory slot locking device arranged on the main board 2, and the main board 2 is fixed by a main board rivet post 9 On the motherboard fixing frame 1; after the memory 4 is inserted into the memory slot locking device on the motherboard 2, install the memory fixing device on the outside of the memory 4; the memory fixing device fixes the motherboard 2 and the memory 4 together through the six corrugated copper pillars 3 On the motherboard fixing frame 1; the memory fixing device includes a memory fixing frame 5 and a memory fixing part 6, and the memory fixing part 6 is connected to the inner side surface of the memory fixing frame 5 by a screw 10, and the memory fixing device is installed in place so that the memory fixing part 6 It is arranged between the memory fixing frame 5 and the memory 4;...

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Abstract

The invention discloses a reinforced method of an internal memory, belonging to the technical field of internal memory reinforcement. The internal memory comprises a main board, a main board fixed frame and an internal memory; the internal memory is fixed on the main board through an internal memory slot position clamping device arranged on the main board; the main board is fixed on the main boardfixed frame through a main board riveting column; an internal memory fixed device is mounted outside the internal memory; the main board and the internal memory are fixed on the main board fixed frame together through a stud mounted in a riveting manner by the internal memory fixed device. The internal memory fixed device comprises an internal memory fixed frame and an internal memory fixed piece; the memory fixed piece is connected to the inner side surface of the internal memory fixed frame through a screw nail; the internal memory fixed device is mounted in place to ensure that the internal memory fixed piece is arranged between the internal memory fixed frame and the internal memory; the internal memory fixed frame, the main board and the main board fixed frame are respectively provided with a screw hole which is matched with the stud mounted in a riveting manner in consistent position. Compared with the prior art, the internal memory reinforcement method greatly improves the stability of the internal memory in vibration-impact environment.

Description

technical field [0001] The invention relates to the technical field of memory hardening, in particular to a memory hardening method. Background technique [0002] Nowadays, most of the memory uses the catch device of plastic parts to ensure the good contact of the memory. For example, the general memory only relies on the memory slot clamping device to realize the fixation of the memory; In a good indoor environment, in a harsh environment, when the memory is subjected to relatively frequent vibration shocks, there will be problems with the contact of the memory. [0003] At present, in ruggedized computers and servers, due to the long-term harsh working environment, the reliability and stability of memory are highly required. Because the ruggedized devices are in high vibration, shock, salt spray and humid environments, the memory often has poor contact and damage, which seriously affects the normal use of the device. [0004] How to make the memory meet the environmental...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18
Inventor 秦新玲张廷银任洪伟鹿博陈乃阔
Owner SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD