Nickel-based target and production process

Abstract

The invention discloses a nickel-based target and a production process. The production process comprises working procedures of cold rolling, high-temperature vacuum heat treatment, ammonia atmosphere protective heat treatment, primary rolling, welding, precision rolling, annealing and the like. The production process has no high-temperature processes of smelting, hot rolling and the like, and also has no high-pollution processes of acid washing, alkali washing and the like. Therefore, compared with the conventional process, the production process reduces the energy consumption by 30 percent and the metal loss by 50 percent, improves the one-time yield by over 10 percent, has high comprehensive utilization rate of resources, and is environmentally-friendly; and the process is simple and convenient to operate, can effectively guarantee the purity of a electrolytic nickel thin plate, improve the comprehensive mechanical property and physical property of the electrolytic nickel thin plateand replace the prior production process for smelting and hot-rolling the nickel target, and is suitable for industrialized production.

Description

technical field [0001] The invention discloses a nickel-based target material for magnetron sputtering and a production process, in particular to a high-purity electrolytic nickel cold-rolled nickel-based target material and a production process, belonging to the technical field of metal material processing. Background technique [0002] Metal nickel sheet is widely used in BLD electronic products. As its raw material, it is required to have good electrical conductivity and a sufficiently thin thickness. The content is directly related; the thickness of the nickel-based target is related to the microstructure of the nickel alloy. The nickel-based target is generally produced using electrolytic nickel as a raw material. As a smelting product, the purity of electrolytic nickel itself can reach more than 99.9%. For cold rolling, because the process is a complete physical process, its composition will not change, and there will be no metal loss such as adhesion and burning, so t...

AI Technical Summary

Problems solved by technology

[0004] National standard (GB5235-85): N 6 The purity of the nickel-based target is Ni+Co≥99.5%, trace impurity elements account for 0.5%, respectively: C: ≤0.1; Cu.≤0.06; Fe.≤0.1; Si: ≤0.1; Mn: ≤0.05; Mg : ≤0.1; S: ≤0.005; P: ≤0.002; Pb: ≤0.002; Bi: ≤0.002; As: ≤0.002; In the above-mentioned production process, the electrolytic nickel is smelted and hot-rolled first to adjust its microstructure, and then the subsequent processing procedures are carried out; in the process of smelting and thermal processing, impurity elements such as C, S, P The increase of , O, Cu, Fe, etc. reduces the purity of the original pure metal. Therefore, it is difficult to guarantee the production of nickel-based targets that meet the requirements of the national standard (GB5235-85) by the traditional nickel-based target production process; especially C , S, P, O, Cu, Fe and other impurity elements are precipitated and enriched at the grain boundary at room temperature, which seriously deteriorates the electrical conductivity and corrosion resistance of the nickel-based target.

In addition, in the process of smelting and thermal processing, due to the adhesion and oxidative burning of the metal melt, about 6% of the metal loss will be caused, the energy consumption is high, the labor intensity is high, and a large amount of CO is emitted. 2 and other greenhouse gases, its resource utilization and production efficiency are low; moreover, the performance of the nickel-based targets produced cannot meet the requirements of BVD electronic products