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Electroplating device of copper plating of graphite powder and technique
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An electroplating device and electroplating process technology, applied in the direction of electrolysis process, electrolysis components, etc., can solve the problems of low deposition rate, unfavorable copper deposition, low limit current, etc. Effect
Inactive Publication Date: 2011-06-01
GCI SCI & TECH +1
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Problems solved by technology
However, because conventional electroplating does not circulate the plating solution, it is not conducive to the graphite powder to contact the cathode surface, and it is not conducive to the deposition of copper on the graphite surface, and the limiting current is low, resulting in a low deposition rate, rough coating, and not dense
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Embodiment 1
[0041] The base material is 200 mesh flake graphite, the specific operation steps are as follows:
[0042] Graphite pretreatment
[0043] A: Use a muffle furnace for degreasing at high temperature, temperature: 600℃, time: 30min;
[0045] C: Wash with distilled water until neutral;
[0046] Flow copper plating
[0047] Plating solution preparation and operating conditions: copper sulfate 10g·dm -3 , Graphite powder 15g·dm -3 , Concentrated sulfuric acid 5cm 3 ·Dm -3 , Glacial acetic acid 0.2cm 3 ·Dm -3 , Formamide 0.3cm 3 ·Dm -3 , The number of plating tank combinations is 2; temperature is 60℃; plating solution flow rate is 12dm -3 ·Min -1 ; Ultrasonic frequency 20kHz current density 30A·dm -2 ,; Time 20min.
[0048] (3) Post-treatment of graphite powder copper plating
[0049] A: Washing treatment of copper-clad graphite powder: use 5% Na for the above-mentio...
Embodiment 2
[0053] The base material is 200 mesh flake graphite, which is different from Example 1 in:
[0054] Flow copper plating
[0055] Plating solution preparation and operating conditions: copper sulfate 10g·dm -3 , Graphite powder 15g·dm -3 , Sodium hypophosphite 5g·dm -3 , Concentrated sulfuric acid 5cm 3 ·Dm -3 , Glacial acetic acid 0.2cm 3 ·Dm -3 , Formamide 0.3cm 3 ·Dm -3 ; The number of plating tank combinations is 2; the temperature is 60℃; the plating solution flow rate is 12dm -3 ·Min -1 ; Ultrasonic frequency 20kHz; Current density 30A·dm -2 ; Time 20min.
[0056] The remaining steps are the same as in Example 1.
[0057] The copper-clad graphite powder composite material prepared in this example has a copper mass fraction of 60%, and the coating is dense and uniform.
Embodiment 3
[0059] The base material is 200 mesh flake graphite, which is different from Example 1 in:
[0060] Flow copper plating
[0061] Plating solution preparation and operating conditions: copper sulfate 8g·dm -3 , Graphite powder 15g·dm -3 , Sodium hypophosphite 10g·dm -3 , Concentrated sulfuric acid 5cm 3 ·Dm -3 , Glacial acetic acid 0.2cm 3 ·Dm -3 , Formamide 0.3cm 3 ·Dm -3 ; The number of plating tank combinations is 2; the temperature is 60℃; the plating solution flow rate is 12dm -3 ·Min -1 ; Ultrasonic frequency 20kHz; Current density 30A·dm -2 ; Time 20min.
[0062] The remaining steps are the same as in Example 1.
[0063] The copper-clad graphite powder composite material prepared in this example has a copper mass fraction of 65%, and the coating is dense and uniform.
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Abstract
The invention discloses an electroplating device of copper plating of graphite powder and a technique. The reaction device comprises a special electroplating bath with the bottom part of being a cathode stainless steel plate, and carries out multi-group overlapping of 1 to 3 plating baths according to production needs, thus improving deposition efficiency and shortening deposition time. The bottom part of the cathode stainless steel plate is provided with an ultrasonic vibrating device, and leads metallic copper to be deposited on graphite particles so as to form a copper-coated graphite powder compound material. The electrolyte adopted by the flowing copper-coating technique is as follows: 8 to 12g.dm<-3> of CuSO4, 0 to 20g.dm<-3> of NaH2PO2.H2O, and little amount of surface active agent. The applied current density is 20 to 40A.dm<-2>, the reaction temperature is 60 DEG C, the loading amount of the graphite powder is 5 to 15g.dm<-3>, the flow speed of the plating solution is controlled into 8 to 12dm<-3>.min<-1>, and the electroplating time is 20 to 40min. The device for preparing the graphite powder material shortens the production period, the prepared copper-plated layer of the copper-coated graphite powder is even and continuous and has the same thickness, the production efficiency is improved and the production cost is reduced. The device has simple structure, reasonabletechnique design and convenient operation.
Description
Technical field [0001] The invention relates to a production device and process for copper-plating graphite powder, in particular to a process for electroplating copper with ultrasonic flow on flake graphite. The copper-clad graphite powder produced by the process can be used to manufacture high-performance electric brushes and high-speed Copper / graphite composite materials for train pantograph slides, small precision self-lubricating sliding bearings and other sliding electrical contact parts. Background technique [0002] With the development of modern science and technology, composite materials have received increasing attention. The coating of copper on the graphite surface is of great significance to the improvement of graphite performance. Its excellent wear resistance, low friction factor and low impedance comprehensive properties greatly exceed the mechanical mixture of graphite powder and copper powder. Therefore, copper-clad graphite powder composite materials are wide...
Claims
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Application Information
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