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Electronic component mounting device and mounting method

A technology of electronic parts and installation devices, applied in the direction of electrical components, electrical components, circuits, etc.

Active Publication Date: 2011-05-04
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when rotational resistance is applied to the delivery body, the stretchable synthetic resin sheet may be stretched due to the rotation resistance of the delivery body, and slack may occur due to the stretching, resulting in poor installation due to the looseness.

Method used

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  • Electronic component mounting device and mounting method
  • Electronic component mounting device and mounting method
  • Electronic component mounting device and mounting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] In addition, a heater 7 a is provided in the crimping tool 7 , and presses and heats the TCP 5 and the anisotropic conductive member 4 when the TCP 5 is actually crimped. As a result, the anisotropic conductive member 4 is melted and solidified to fix the TCP 5 , that is, to fully press-bond the TCP 5 to the substrate 3 .

[0029] A pair of rail members 11 (only one shown) are horizontally provided along the front-rear direction of the device body 1 at both ends in the width direction of the device body 1 slightly above the support member 6 . On the device main body 1 , the cartridge 12 can be attached and detached along the above-mentioned rail member 11 .

[0030] When the cartridge 12 is mounted on the device main body 1 , a stopper (not shown) provided at a predetermined position of the cartridge 12 abuts against an abutting portion (not shown) provided on the device main body 1 . Thereby, the above-mentioned cartridge 12 is positioned.

[0031] like figure 1 an...

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PUM

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Abstract

An electronic component mounting device comprises a backup member (6) for supporting the lower surface of a portion to which a TCP is pressure-bonded of a substrate; a pressure bonding tool (7) for pressure-bonding the TCP (5) to the upper surface of the portion supported by the backup member of the substrate by applying pressure; a cassette (12) having a supply shaft (23) wound with a sheet for supplying the sheet when rotationally driven by a supply motor and a take-up body (25) for taking up the sheet supplied from the supply shaft when rotationally driven by a take-up motor, with a portion of the sheet between the sheet supply shaft (23) and take-up body (25) placed between the TCP and the pressure bonding tool when the TCP is pressure-bonded to the substrate by the pressure bonding tool detachably provided to the body of the device; and a control unit for operating the supply motor to supply a predetermined length of the sheet from the supply shaft and then operating the take-up motor to take up the predetermined length of the sheet supplied from the supply shaft.

Description

technical field [0001] The present invention relates to a mounting device and mounting method of electronic components, which press-bond electronic components to a substrate via a thermosetting anisotropic conductive member. Background technique [0002] For example, a TCP (Tape Carder Package) as an electronic component is pressure-bonded to a liquid crystal cell as a substrate through an anisotropic conductive member made of a thermosetting resin as an adhesive material. The above-mentioned liquid crystal cell is configured by bonding two glass plates at a predetermined interval with a sealant, sealing liquid crystal between these glass plates, and attaching polarizing plates to the outer surfaces of the glass plates. Further, in the liquid crystal cell having the above configuration, the tape-shaped anisotropic conductive member is pasted on the upper surface of the edge portion, the TCP is temporarily crimped on the anisotropic conductive member, and then the actual cri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60G02F1/1345H05K13/04
CPCG02F1/13452H05K3/323H05K13/0417H05K13/0469H05K2203/1545H05K13/02H05K13/04
Inventor 小木曾睦池田和仁
Owner SHIBAURA MECHATRONICS CORP