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Semiconductor refrigeration camera shield

A camera and semiconductor technology, applied in the field of semiconductor refrigeration camera shields, can solve the problems of cumbersome assembly, large processing volume, large cumulative error, etc., and achieve the effects of wide application and promotion value, simple processing and reasonable structure

Inactive Publication Date: 2011-02-02
天津市中环系统工程有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Over the years of practical application, the device has stable electrical properties, that is, stable cooling and heating functions, but its structure is complicated, the amount of machining is large, the assembly is cumbersome, and the cost is high. The existing problems include 1. The cover body is rectangular , the inner and outer three-layer junctions are all veneers; the cumulative error is large, and assembly is difficult; 2. The front and rear support frames are square, and all surfaces need to be machined to obtain, and the processing volume is large; 3. The shape is rectangular, which is not beautiful; 4. Large size and heavy weight; 5. High cost

Method used

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  • Semiconductor refrigeration camera shield
  • Semiconductor refrigeration camera shield
  • Semiconductor refrigeration camera shield

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Embodiment Construction

[0010] In order to understand the present invention more clearly, further describe below in conjunction with accompanying drawing and embodiment:

[0011] Such as figure 1 , 2 As shown, in the overall structure of the semiconductor cooling camera protective cover: the overall structure of the protective cover is cylindrical, including inner and outer layers, the inner layer is the inner wall of the camera, and has a cooling surface (taking the semiconductor cooling protective cover as an example); The first layer is a heat dissipation surface, and is covered with an axial flow fan and a radiator, and the inner and outer layers are separated by a temperature-insulating material. The inner and outer sleeves are connected with the front and rear flanges. The main means of connection are argon arc welding and screw fastening. The front end of the protective cover is equipped with heat-resistant optical glass, and the rear end is equipped with a rear cover. A sealing ring is ar...

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Abstract

The invention relates to a semiconductor refrigeration camera shield which mainly comprises a semiconductor camera sheath, a semiconductor camera inner bushing, a cooling fin, a bracket, a baseplate, an axial flow fan, a refrigeration sheet, a temperature guide plate and a semiconductor camera rear cover. A sheath front flange is installed on a front end part in a sheath sleeve; a temperature insulation layer is arranged on the inner wall of the sheath sleeve; a cooling window is arranged below the rear part of the sheath sleeve; the lower part of the semiconductor camera sheath is connected with the cooling fin; and the axial flow fan is installed at the lower part of the baseplate. On the basis of energy conservation law, according to the refrigeration character of semiconductors, a semiconductor refrigeration camera is designed from the aspect of the design of mechanical mechanisms, so that the refrigeration and heating effects of the semiconductors reach using requirements, and the advantages of reasonable structure, attractive appearance and high cost performance can be achieved; in addition, most of workpieces of the main structure of the semiconductor refrigeration camera shield are round discs or in a cylindrical shape, therefore, the semiconductor refrigeration camera shield is processed simply, and the cost is reduced greatly in comparison with conventional similar equipment, thereby achieving wide application and promotion values.

Description

technical field [0001] The invention relates to a camera protection device, in particular to a semiconductor refrigeration camera protection cover used in iron and steel electric power, glass, cement, petrochemical and other industries. Background technique [0002] In the early 1970s, the scientific and technical personnel of our institute adopted the semiconductor cooling and heating technology to protect the camera in the harsh environment from high and low temperature. This protective cover is especially suitable for the situation where there is no cooling medium (cooling air cooling water), the dust density is high, and the ambient temperature is high. Or places with ultra-low temperature and where personnel cannot stay; the camera in the semi-conductor cooling hood can replace people to monitor the working surface. [0003] Over the years of practical application, the device has stable electrical properties, that is, stable cooling and heating functions, but its struct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225
Inventor 汪怡李秀云费建军郭川李鸿慧孙裕昌谢宁
Owner 天津市中环系统工程有限责任公司
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