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Testing module of wireless radio frequency recognition chip and application method thereof

A wireless radio frequency, test module technology, applied in the direction of electronic circuit testing, instruments, inductive record carriers, etc., can solve the problems of damage to the known test system of integrated circuits, unsuitable integrated circuit chips, expensive and other problems

Inactive Publication Date: 2012-06-13
MUTUAL PAK TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, known test systems are only useful for integrated circuits formed on wafers that have not been diced, and are not suitable for diced integrated circuit chips.
In practice, this is a major disadvantage, since the step of dicing the integrated circuit chip still has the risk of damaging the integrated circuit and known test systems are also quite expensive

Method used

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  • Testing module of wireless radio frequency recognition chip and application method thereof
  • Testing module of wireless radio frequency recognition chip and application method thereof
  • Testing module of wireless radio frequency recognition chip and application method thereof

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Embodiment Construction

[0045] Preferred embodiments of the present invention will be exemplified below with reference to the accompanying drawings. Similar elements in the figures use the same reference numerals. It should be noted that in order to clearly present the present invention, the components in the drawings are not drawn according to the actual scale, and to avoid obscuring the content of the present invention, the following description also omits traditional components, related materials, and related processing techniques.

[0046] Figure 1A It is a schematic cross-sectional view of the test module of the radio frequency identification chip of the present invention. Such as Figure 1A As shown, the test module of the present invention includes a test head 10 and a test machine 15 . The test head 10 includes a chip carrier 110 for carrying a radio frequency identification chip 17 to be tested. The chip carrier 110 has a first antenna 111 electrically connected to the radio frequency ide...

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Abstract

The invention discloses a testing module of wireless radio frequency recognition chip and an application method thereof. The testing module of the invention comprises a testing head comprising a chip load receptor for loading a wireless radio frequency recognition chip to be tested. The chip load receptor comprises a first antenna which is electrically connected with the wireless radio frequency recognition chip to be tested. The testing head further comprises a second antenna for communicating with the first antenna; and a base for supporting the chip load receptor and the second antenna. The testing module further comprises a tester stock which is electrically connected with a second antenna. The tester stock tests the function of the wireless radio frequency recognition chip to be tested via the communication between the first antenna and de second antenna.

Description

technical field [0001] The present invention relates to an integrated circuit test module and its usage method, and more particularly relates to an integrated circuit test system utilizing a radio frequency identification system. Background technique [0002] The latest developments in the industry have made radio frequency identification systems (hereinafter referred to as RFID systems) an important part of logistics applications. In general, an RFID system usually includes a radio frequency identification device having an integrated circuit and an antenna connected to the integrated circuit. The RFID system also includes a read / write machine, which provides a radio frequency (RF) carrier signal for powering the radio frequency identification element and uses the RF carrier signal to exchange data with the radio frequency identification element in a non-contact manner. [0003] Various functional tests must be carried out during the manufacture of RFID components. However...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G06K7/00
Inventor 黄禄珍
Owner MUTUAL PAK TECH