Flexible print wiring plate and its manufacturing method
A flexible printing and manufacturing method technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit parts, etc., can solve the problems of inability to form thickness, leakage, etc., and achieve the effect of convenient current adjustment
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no. 1 approach
[0029] figure 1 It is a plan view which shows the flexible printed wiring board sheet 50 in 1st Embodiment of this invention. In the following description, a flexible printed wiring board and a flexible printed wiring board sheet are abbreviated as FPC and FPC sheet, respectively. The FPC sheet 50 has a rectangular shape as a whole, and is provided with an outer frame portion 5 so as to surround a product area 7 in which a plurality of FPCs 10 constituting a final product are arranged. This FPC 10 is a magnetic head wiring board in which supporting metal foil and wiring for signal transmission are integrally formed. The greatest feature of the FPC sheet 50 of the present embodiment is that round holes serving as notches 5 h are dispersed throughout the outer frame portion 5 surrounding the product area 7 . The function of the notch portion 5h provided in the outer frame portion 5 will be sequentially described later.
[0030] figure 1 Among them, on the FPC sheet 50, a pla...
no. 2 approach
[0047] Figure 8A ~ Figure 8C It is a figure for demonstrating the manufacturing method of the flexible printed wiring board sheet of 2nd Embodiment of this invention. In the manufacturing method of this embodiment, no through-holes are provided in the outer frame portion 5 of the base sheet, but the feature is that high-precision control of the plating current is realized by the resist pattern R1. The manufacturing method is roughly as follows.
[0048] (S1) The polyimide layer 2 is formed on the stainless steel foil 1, and the conductive thin film 3 is formed on the polyimide layer 2. The conductive thin film 3 is formed of nickel, chromium, etc., which have high adhesion to polyimide as described above, and is preferably formed by electroless plating or sputtering.
[0049] (S2) If Figure 8A As shown, the resist pattern R1 is formed at the same probability on the product area 7 and the outer frame portion 5 . The resist pattern R1 of the outer frame portion 5 has, for ...
no. 3 approach
[0055] Figure 9 The figure which shows the plating processing apparatus 70 of 3rd Embodiment of this invention. A plating solution 75 is poured into the plating tank 77 , and the substrate sheet 50 b is arranged in the plating solution 75 . Wiring 72 drawn from a cathode (not shown) is connected to the plating frame 21 of the base material sheet 50b. Moreover, the metal plate 71a connected to the cathode wiring 71 is arrange|positioned facing the base material sheet 50. As shown in FIG. As the metal plate 71a, a copper plate is used in the case of copper plating, and a gold plate is used in the case of gold plating. exist Figure 9 In this case, the outer frame portion of the base material sheet 50b is covered with an outer frame portion mask 81 formed of an insulator. Figure 10 It is a perspective view showing the outer frame portion mask 81 . The outer frame portion mask 81 is attached to the base material sheet 50b by clips 83, and covers the outer frame portion of t...
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