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Laser processing device and method for groove grinding wheel with U-shaped section profile

A laser processing method and cross-sectional profile technology, which is applied in the direction of grinding devices, laser welding equipment, metal processing equipment, etc., can solve the problems of width reduction, reduction of grinding cooling effect, reduction of groove area ratio, etc., to achieve improved Long service life, improved grinding stability, and high material removal efficiency

Active Publication Date: 2022-03-01
SHANGHAI JIAO TONG UNIV
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Problems solved by technology

However, due to the cumulative effect of laser damage, the depth of the trench increases gradually along the width of the trench, forming sloped sidewalls.
During the grinding process, with the wear of the grinding wheel, the width of the groove with inclined side walls decreases rapidly, and the area ratio of the groove decreases accordingly, which reduces the cooling effect of grinding

Method used

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  • Laser processing device and method for groove grinding wheel with U-shaped section profile
  • Laser processing device and method for groove grinding wheel with U-shaped section profile
  • Laser processing device and method for groove grinding wheel with U-shaped section profile

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Embodiment Construction

[0041] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0042] According to a laser processing device and method of a grooved grinding wheel with a U-shaped cross-sectional profile provided by the present invention, the device includes: ultrafast laser processing equipment 1, a rotating motor 2, a grinding wheel 3, and a fixing fixture 4; the grinding wheel 3 is fixed on the rotating motor 2; the rotating motor 2 is installed on the ultrafast laser processing equipment 1 through a fixing fixture 4; the ultrafast laser processing equipment 1 includes a vibrati...

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Abstract

The invention provides a laser machining device and method for a groove grinding wheel with a U-shaped section contour, the required device comprises ultrafast laser machining equipment, a rotating motor, a grinding wheel and a fixing clamp, the machining method comprises the steps that parallel scanning laser is gradually biased to the right side from the left side of a groove, and the distance between two adjacent scanning paths is L; then returning to the left side of the groove, wherein the distance between two adjacent scanning straight lines is L; the distance between the laser scanning arrays from left to right and the distance between the laser scanning arrays from right to left are L / 2. After a certain scanning cycle, a groove is machined; the rotating motor drives the grinding wheel to rotate by a certain angle, and the next groove is machined repeatedly. According to the laser reciprocating scanning machining method, the influence of the laser damage cumulative effect on single-side inclination of the groove contour can be restrained, so that the groove structure with the U-shaped contour is obtained, and the grinding stability of the groove grinding wheel is improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing device and method for a grooved grinding wheel with a U-shaped cross-sectional profile. Background technique [0002] Grinding is a processing method that uses abrasives to remove workpiece material to obtain good dimensional accuracy and surface accuracy. The abrasive grains of the grinding wheel mostly have a negative rake angle, the grinding force is large, and a large amount of heat will be generated during the grinding process. The amount of material removed during the grinding process is small, and the chips only take away a small part of the grinding heat, and most of the heat is transferred to the workpiece, resulting in an increase in the temperature of the workpiece. When the temperature in the grinding area is too high, it will cause grinding burns of the workpiece, which may form residual tensile stress. When the residual tensile stress is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00B23K26/364B23K26/70
CPCB24D18/009B23K26/364B23K26/702Y02P70/10
Inventor 姚振强侯志保张西方
Owner SHANGHAI JIAO TONG UNIV