Soft-hard printed circuit board combination process

A soft-rigid combination board and soft-rigid combination technology, which is used in the manufacture of multi-layer circuits and the assembly of printed circuits with electrical components.

Active Publication Date: 2010-06-02
XIAMEN HONGXIN ELECTRON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0023] 1. The flexible board area of ​​the soft-rigid board needs to be protected, but during the production, especially after the DES line, copper plating and other wet processes, the liquid medicine will penetrate into the inner flex board, causing abnormalities in the inner layer
[0024] 2. The base material of the rigid board, FR4 copper-clad laminate, is double-sided copper foil. To make the outer hard board of the soft-rigid board, only one side of copper is needed, and one side of the copper needs to be etched away, which wastes one side of copper and increases the process. high cost
[0025] 3. FR4 copper-cl...

Method used

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  • Soft-hard printed circuit board combination process
  • Soft-hard printed circuit board combination process
  • Soft-hard printed circuit board combination process

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Embodiment Construction

[0057] Such as figure 1 Shown, the present invention is a kind of combination process of soft and hard circuit board, and it comprises the following steps:

[0058] (1) Cutting: Cut the materials used according to the specifications and sizes required for production;

[0059] (2) Cover film punching: Cover films 29 and 30 are the outer cover films of the product respectively, which need to be punched out of the corresponding windows of the outer layer circuit fingers, pads, etc., so that the circuit is connected to the outside world;

[0060] Single-sided copper-clad laminate drilling: single-sided copper-clad laminates 21, 22, 25, and 26 are the layers of the product, of which single-sided copper-clad laminates 21 and 22 are inner flexible circuit boards, and single-sided copper-clad laminates 25 and 26 are outer layers. Layer flexible circuit board, first drill out the alignment hole for subsequent alignment;

[0061] Pure rubber drilling: pure rubber 23, 27, 28 acts as a ...

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Abstract

The invention discloses soft-hard printed circuit board combination process, including that bonding sheets are firstly packaged between inlayer flexible printed circuit boards, the inlayer flexible printed circuit boards are subject to lamination and curing, and then outer flexible printed circuit board is packaged, thus completing forming of soft-hard printed circuit board. PI copper foil used by flexible printed circuit board is more than FR4 copper foil used by hard printed circuit board, thus the hole depth of outer blind hole can be well controlled, the blind hole depth can be controlled to be 40 Mum if 12 Mum no-glue PI copper foil is used, thus greatly improving blind hole copper depositing and plating yield. Thus, the invention can conveniently control the outer blind hole depth while ensuring rigidity and thickness of four-layer HDI soft-hard printed circuit board and improve blind hole copper depositing and plating quality, PI copper foil and PP bonding sheet are adopted, structure is simple and the soft-hard printed circuit board is easy to make, cost is low, and electric performance of product is improved.

Description

technical field [0001] The invention relates to a circuit board processing method, in particular to a combination process of soft and hard circuit boards. Background technique [0002] With the development of electronic technology, especially the continuous improvement of electronic assembly technology, in many cases, it is difficult for ordinary rigid circuit boards to meet the requirements of "light, thin, short and small" electronic products. The flexible circuit board, with its "light and thin" and "bendable" characteristics, can just meet this trend, especially the rigid-flex circuit board (a circuit board combined with a flexible base material and a rigid base material) has the advantages of a rigid circuit board. It has a supporting function and the characteristics of a flexible circuit board, so its application has more and more extensive prospects due to its remarkable advantages, and it can be used in almost all kinds of electronic equipment. At present, the struc...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/36
Inventor 何耀忠续振林陈妙芳郑福建董志明
Owner XIAMEN HONGXIN ELECTRON TECH
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