Blind hole-filling electroplating process, plated part obtained according to process, application of plated part, and electronic product

An electroplating process and blind hole technology, applied to electrical components, circuits, printed circuits, etc., can solve problems such as long time, difficult supply of metal ions, copper thickness of copper plating surface, etc., to avoid core and missing filling, improve Distributed across the board, avoiding the effect of filling holes

Active Publication Date: 2020-06-12
东莞市康迈克电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For the above two types of hole types, DC (waveform) electroplating is currently used to fill holes, but it shows certain limitations:
[0005] For blind holes with ordinary depth-to-diameter ratios, the currently used DC hole filling process is the most mature and stable, but the efficiency is low. If the holes are to be filled, the copper on the copper-plated surface is thicker and the time is longer (usually the thickness of copper plating ≥10um; the time is greater than 40 minutes), which is not conducive to the production of thin lines
[0006] For blind hole filling with high depth-t

Method used

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  • Blind hole-filling electroplating process, plated part obtained according to process, application of plated part, and electronic product
  • Blind hole-filling electroplating process, plated part obtained according to process, application of plated part, and electronic product
  • Blind hole-filling electroplating process, plated part obtained according to process, application of plated part, and electronic product

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0153] The preparation method of the leveling agent includes: take 2g of N,N-dimethyl 1,4-butanediamine into a 50mL round neck flask, then add 5g of water to the flask and stir; place the flask in an oil bath And fix it, install a condensing reflux tube on the flask; heat the oil bath to 95℃, then slowly add 2.45g of 1,7-octadiene diepoxide compound; when the filling is completed, the temperature of the oil bath rises to 115℃ and keeps it Five hours; turn off the heating and continue to stir; cool to room temperature and collect the product, which is yellow-brown. The product is purified and dried to obtain a white powder, which is a leveling agent.

[0154] (c) Wash the test board with water: two times: the first is 3 minutes, the second is 2 minutes.

[0155] (d) Dry the test board.

[0156] (e) Cut the sample and make slices.

[0157] (f) Analyze slices and export data.

Example Embodiment

[0158] Example 1

[0159] For blind holes with a diameter of 110 μm and a depth of 85 μm, pulse filling can effectively improve the copper plating efficiency, which is 60% higher than that of DC electroplating.

[0160] The current density is 40ASF, and the total filling and plating time is 35 minutes. Use forward pulse waveform: forward current 40ASF, no direction current (reverse direction current is 0); forward current time is 40 milliseconds, reverse time is 0; pause time (current is 0 time) is 4 milliseconds; No phase difference (phase is 0), that is, the waveforms of test board A and B are synchronized; use waveform 1 for electroplating time of 25min; waveform 2 for DC waveform, continue electroplating for 10 minutes. The combined waveform is shown in Table 1.

[0161] The slice picture after electroplating is as follows Figure 5 As shown, it can be seen that: 1. The hole is filled without void; 2. The depression is less than 10 μm; 3. The copper plating thickness is 16 μm. ...

Example Embodiment

[0165] Example 2

[0166] For blind holes with relatively high depth (one-time filling of second-order blind holes), the combined positive and negative pulse combination waveform is selected. The combined waveform is shown in Table 2.

[0167] Table 2

[0168]

[0169] The slice picture after electroplating is as follows Image 6 As shown, it can be seen that: 1. The hole is filled without void; 2. The depression is less than 10 μm; 3. The copper plating thickness is 20 μm.

[0170] Image 6 Among them, the hole diameter is 102.07μm, the hole depth is 122.48μm, and the hole filling depression is 7.02μm.

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Abstract

The invention relates to the field of electroplating, in particular to provide a blind hole-filling electroplating process, a plated part obtained according to the process, application of the plated part, and an electronic product. The blind hole-filling electroplating process comprises the following step of filling a blind hole of the plated part through pulse electroplating, or filling the blindhole of the plated part through a combination of pulse electroplating and direct current electroplating. The process can effectively improve copper plating performance and efficiency and plating distribution: for blind holes with ordinary depth-to-diameter ratio, higher current density (improved from the previous 20ASF to 50ASF) is required in filling, the efficiency is improved, and the thickness of copper of a surface is reduced; bulging of filled holes is avoided, and the distribution of the whole board is improved; the blind hole-filling electroplating process is suitable for high-end HDItechnology; and for the filling of blind holes with high depth-to-diameter ratio, void and skip plating can be avoided, so that the quality of hole filling is improved.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a blind hole filling electroplating process, a plated part obtained by using the process, an application of the plated part, and an electronic product. Background technique [0002] As electronic products become more and more widely used, the demand for small and powerful integrated circuits and circuit boards is also increasing, and integrated circuits or circuit boards are usually provided with blind holes for interconnection of various layers. [0003] At present, there are two kinds of blind hole diameters: (1) Ordinary depth-to-diameter ratio blind holes: With the continuous miniaturization and more powerful functions of consumer electronics products, more and more layers of circuit boards are required, and more and more interlayers are required. The thinner it is, the smaller the line width / line spacing (L / S), and the smaller the diameter of the blind hole that acts as a conne...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/18H01L21/768H05K3/00
CPCC25D3/38C25D5/18H01L21/76879H05K3/0094
Inventor 张二航
Owner 东莞市康迈克电子材料有限公司
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