Micro-electro-mechanical microphone packaging structure
A micro-electromechanical microphone and packaging structure technology, applied in the direction of micro-structure technology, micro-structure devices, circuits, etc., can solve the problems of insufficient guarantee of electrical conduction, inconvenience, and general products without suitable structures, so as to increase the reliability of functions sexual effect
Inactive Publication Date: 2010-06-09
MERRY ELECTRONICS CO LTD
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Problems solved by technology
[0004] Although the micro-electromechanical microphone packaging structure 10 disclosed in the above-mentioned patent has been able to improve the interference of electromagnetic waves, it is still not enough to ensure the electrical conduction between the cover 20 and the substrate 14. Conductive glue 23 is used for bonding, and the use of conductive glue 23 is too wasteful, so the conventional MEMS microphone packaging structure 10 does have its need for improvement.
[0005] It can be seen that the above-mentioned existing micro-electromechanical microphone packaging structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem
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[0048] In order to further illustrate the technical means and effects that the present invention takes to achieve the intended invention purpose, below in conjunction with the accompanying drawings and preferred embodiments, its specific implementation, structure, features and features of the micro-electromechanical microphone packaging structure proposed according to the present invention Efficacy, detailed as follows.
[0049] see figure 1Shown is a schematic cross-sectional view of a preferred first embodiment of the present invention. The microelectromechanical microphone packaging structure 1 of the preferred first embodiment of the present invention includes a cavity, a microelectromechanical microphone module 20 and a conductive element 40, wherein the cavity is formed by correspondingly combining a substrate 10 and a metal cover 30, The MEMS microphone module 20 is disposed in the cavity, and the conductive element 40 is disposed in the cavity and electrically connect...
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The invention discloses a micro-electro-mechanical microphone packaging structure, which is provided with a cavity body, a micro-electro-mechanical microphone module and an electric conduction element. The cavity body is formed by combining a substrate and a metal cover, the periphery of the cavity body is provided with a sound hole for transmitting external sound to the cavity body; the micro-electro-mechanical microphone module is arranged in the cavity body to receive the external sound; and the electric conduction element is arranged in the cavity body and electrically connected with the substrate, the metal cover and the micro-electro-mechanical microphone module to form electric conduction. Therefore the effect of electromagnetic protection is achieved.
Description
technical field [0001] The invention relates to a packaging structure of a micro-electromechanical microphone, in particular to a packaging structure of a micro-electromechanical microphone that increases the reliability of electromagnetic protection functions. Background technique [0002] The current common microphones are usually electret microphones, and the functional requirements are all aimed at reducing the volume. Due to the advancement of technology, micro-electromechanical microphones have been developed in the industry. MEMS microphones are more industrially utilizable in terms of function and size. However, since MEMS microphones must be connected to external sound sources, they are easily affected by external factors. The most common is that electronic components are interfered by electromagnetic waves, causing micro The signal-to-noise ratio of electromechanical microphones is poor, which leads to a decrease in the added value of electronic products; therefore...
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IPC IPC(8): H04R19/04B81B7/00
Inventor 张志伟李国祥
Owner MERRY ELECTRONICS CO LTD