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Water-cooled radiating system and water-cooled device thereof

A water-cooling device and heat dissipation system technology, applied in cooling/ventilation/heating transformation, heat exchange equipment, indirect heat exchangers, etc., can solve problems such as crashes and poor stability of computer operation, and achieve the effect of improving work efficiency

Inactive Publication Date: 2010-06-23
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, when cooling the central processing unit on the computer motherboard, usually a heat sink and a fan are installed on the central processing unit to dissipate heat, but this traditional heat dissipation method cannot be used for a long time or when the central processing unit is overloaded. If the heat dissipation requirements cannot be met, the computer may still experience poor stability or crash

Method used

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  • Water-cooled radiating system and water-cooled device thereof
  • Water-cooled radiating system and water-cooled device thereof
  • Water-cooled radiating system and water-cooled device thereof

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Embodiment Construction

[0011] Please refer to figure 1 The preferred embodiment of the water-cooled heat dissipation system of the present invention includes a water-cooling device 10, a water pump 20, a heat exchanger 30 and a water pipe 40.

[0012] The water cooling device 10 is used to install a heating element, the water pipe 40 communicates with the interior of the water cooling device 10, and cold water enters the interior of the water cooling device 10 from one side and flows out on the other side to provide The heating element dissipates heat, the hot water flowing out is re-cooled into cold water after passing through the heat exchanger 30, and the cooled water is continuously transmitted to the water cooling device 10 under the drive of the water pump 20 to cool the water The device 10 continuously dissipates heat to the heating element. Among them, the water pump 20, the heat exchanger 30 and the water pipe 40 are all relatively mature technologies in the prior art, so their specific struct...

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PUM

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Abstract

The invention relates to a water-cooled radiating system comprising a water-cooled device, a water pump, a heat exchanger and a water pipe, wherein the water-cooled device is arranged on a heating element; the water pipe is communicated into the water-cooled device; cold water enters from one side of the water-cooled device and flows out of the other side of the water-cooled device so as to radiate the heating element; flowed hot water passes through the heat exchanger and is then cooled into the cold water again; and the cold water is continuously delivered into the water-cooled device by being driven by the water pump so that the water-cooled device continuously radiates the heating element. The water-cooled radiating system effectively enhances the radiating efficiency.

Description

Technical field [0001] The invention relates to a heat dissipation system, in particular to a water cooling type heat dissipation system and a water cooling device thereof. Background technique [0002] At present, when cooling the CPU on the main board of a computer, a radiator and a fan are usually installed on the CPU to dissipate heat. However, this traditional way of cooling will cause the CPU to work for a long time or under overload. If the heat dissipation requirement is not met, the computer will still have poor operating stability or crash. Summary of the invention [0003] In view of the foregoing, the present invention provides a water-cooled heat dissipation system that can effectively improve heat dissipation efficiency. [0004] It is also necessary to provide a water cooling device. [0005] A water-cooled heat dissipation system includes a water-cooling device for setting on a heating element, a water pump, a heat exchanger, and a water pipe. The water pipe communic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/473
CPCH01L2924/0002H01L23/473F28F3/12F28D15/00F28F2250/08H01L2924/00
Inventor 蔡申发
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD