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Apparatus for processing a substrate

A substrate, horizontal direction technology, applied in the field of devices for hardening the photoresist layer, can solve the problems of limitation, reduction of time required for photolithography processing, increase of manufacturing cost of photolithography processing devices, etc., and achieve time reduction and manufacturing cost reduction Effect

Active Publication Date: 2013-01-23
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, automatic mechanisms can increase the manufacturing cost of photolithography processing equipment
In addition, in the case of transferring the substrate by an automatic mechanism, there is a limit to the reduction of the time required for photolithography processing

Method used

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  • Apparatus for processing a substrate
  • Apparatus for processing a substrate
  • Apparatus for processing a substrate

Examples

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Embodiment Construction

[0051] The invention will be described in more detail hereinafter with reference to the accompanying drawings showing embodiments of the invention. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In these drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[0052] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or directly connected to the other element or layer. Layers, or the presence of intervening elements or layers. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or lay...

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PUM

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Abstract

The invention provides an apparatus for processing a substrate. The device comprises a coating unit which delivers the substrate along the horizontal direction, and provides the resist composition onto the substrate to form the resist layer on the substrate while delivering the substrate; a baking unit disposed close to the coating unit, which heats the substrate and hardens the resist layer whenthe substrate is delivered along the horizontal direction. A delivery unit is provided between the coating unit and the baking unit in order to deliver the substrate along the horizontal direction.

Description

technical field [0001] In general, embodiments of the invention relate to apparatus for processing substrates. In particular, embodiments of the present invention relate to an apparatus for forming a photoresist layer on a substrate and hardening the photoresist layer during the manufacture of a flat panel display device. Background technique [0002] In the process of manufacturing a flat panel display device such as a liquid crystal display device, a flat panel type substrate made of silicon or glass is generally used, and various processes are performed to form circuit patterns on the substrate. For example, deposition processing, photolithography processing, etching processing, cleaning processing, drying processing, etc. may be performed to form circuit patterns. [0003] The photolithography process includes the coating process of forming a photoresist layer on the substrate, the soft baking process of hardening the photoresist layer, the exposure process of transferr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/16
CPCB65G49/06G02F1/1303G03F7/16H01L21/6715
Inventor 高永珉
Owner SEMES CO LTD