Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheet
A semiconductor and adhesive sheet technology, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor devices, and components of semiconductor/solid-state devices, etc., can solve problems such as breakage and displacement of the mounting position of semiconductor wafers, so as to suppress the reduction of yield, Achieve bond precision, achieve downtime effects
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2010-06-30
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The present invention relates to the use when bonding a semiconductor element to an adherend such as a lead frame, a T A B film, a substrate, or a semiconductor chip produced separately, and then performing wire bonding on the semiconductor element. An adhesive sheet for manufacturing a semiconductor device and a method for manufacturing a semiconductor device using the same. Background technique
[0002] In the conventional manufacturing method of semiconductor devices, after the patterned semiconductor wafer is cut into individual semiconductor chips, it is soldered (die bonded) to a substrate, a lead frame or other semiconductor chips using a thermosetting paste resin (such as The following patent document 1). Then, wire bonding is performed on the semiconductor chip, and the semiconductor chip is sealed with a sealing resin to manufacture a semiconductor package.
[0003] In addition, an adhesive sheet using a combination of a thermosetting resin...
Examples
Embodiment 1
[0093] First, an isocyanate-based crosslinking agent (Nippon Polyurethane Co., Ltd., trade name; Coronate HX) 3 parts, epoxy resin (made by Japan Epoxy Resin Co., Ltd., trade name; Epikote 1003) 33 parts, phenolic resin (Arakawa Chemical Co., Ltd., trade name; P-180) 22 parts and as pigment Dissolve 0.2 parts of ultrafine titanium oxide (manufactured by Titanium Industry Co., Ltd., trade name; STT-4D, average particle diameter: 0.15 μm) in methyl ethyl ketone, and stir to prepare a solution of an adhesive composition with a concentration of 15% by weight. .
[0094] The solution of the adhesive composition was ground and dispersed by a three-roll mill, centrifuged at 400 ppm, and filtered through a 0.7 μm glass filter.
[0095] Next, the filtered solution of the adhesive composition was applied to a release-treated film (core material) containing a polyethylene terephthalate film (thickness 50 μm) that had been subjected to a silicone release treatment, and then the It was d...
Embodiment 2
[0097] An acrylic adhesive composition in which 3 parts of an isocyanate crosslinking agent (manufactured by Nippon Polyurethane Co., Ltd., trade name: Coronate H X) was added to 100 parts of the acrylic adhesive was prepared. In addition, the above-mentioned acrylic adhesive is prepared as follows: 70 parts of 2-ethylhexyl acrylate, 25 parts of n-butyl acrylate and 5 parts of acrylic acid are mixed to prepare an acrylic copolymer using them as constituent monomers, Then, 1 part of the acrylic copolymer and Fastogen Blue GNPS (manufactured by Dainippon Ink Chemical Co., Ltd., blue pigment: copper phthalocyanine pigment, average particle diameter 0.1 μm) as a pigment was dissolved in methyl ethyl ketone. , adjust the concentration to 15%.
[0098] Next, centrifugation was performed in the same manner as in Example 1 above, followed by filtration to produce an adhesive sheet in which an adhesive layer having a thickness of 7 μm was laminated on a release-treated film.