Securing tool and work processing method

A technology for fixing fixtures and workpieces, which is applied in semiconductor/solid-state device manufacturing, electrical components, adhesives, etc. It can solve problems such as excessive wafer action and damage, and achieve the effect of enhanced fixing force

Inactive Publication Date: 2010-08-11
LINTEC CORP +1
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, when the wafer is detached from the holding jig, excessive force is applied to the wafer and breakage is likely to occur

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Securing tool and work processing method
  • Securing tool and work processing method
  • Securing tool and work processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] refer to figure 1 , figure 2 , 1 denotes a fixing jig for fixing a wafer W which is a thin-plate-shaped workpiece. The fixing jig 1 is composed of a plate-shaped jig body 2 and an adhesive layer 3 provided on one side of the jig body 2 .

[0018] The jig main body 2 is formed in a disc shape with a diameter slightly larger than that of the wafer W. As shown in FIG. The material of the jig body 2 is not particularly limited as long as it is a material with excellent mechanical strength, for example, metal materials such as aluminum alloy, magnesium alloy, stainless steel, polyamide, polycarbonate, polypropylene, propylene, polyvinyl chloride, etc. Resin molding materials such as glass, inorganic materials such as glass, and organic-inorganic composite materials such as glass fiber reinforced epoxy resin, etc.

[0019] On one surface of the jig main body 2, a plurality of cylindrical support protrusions 4 having a height of about 0.05 to 0.5 mm and a diameter of about...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

A securing tool and a work processing method. The securing tool comprises a planar tool main body (2), and an adhesion layer (3) for holding a work (W) tightly and removably. The tool main body has a plurality of supporting protrusions (4) for supporting the adhesion layer on one surface, a sidewall (5) of equal height to that of the supporting protrusion is provided at the outer circumference of one surface, the adhesion layer is bonded to the end face of the sidewall, a section space (6) is defined between the adhesion layer and the tool main body, and the adhesion layer is deformed by sucking air in the section space through a vent (7) formed in the tool body. The work can be supported fixedly and securely even when a force is applied to the work during processing. A suction hole (8) not communicating with the section space (6) and opened to the outer surface on the side of the adhesion layer (3) is formed in the tool main body (2). A through hole (9) communicating with the suction hole (8) is formed in the adhesion layer (3) and a suction force is made to act on the work (W) by evacuation through the suction hole (8).

Description

technical field [0001] The present invention relates to a fixing jig for fixing a thin-plate-shaped workpiece such as a semiconductor wafer, and a method for processing a workpiece using the fixing jig. Background technique [0002] In this conductor manufacturing process, there is a process of grinding and thinning the back surface of a semiconductor wafer (hereinafter referred to as wafer) in order to miniaturize the semiconductor chip (back grinding process). In this back grinding step, a protective sheet made of an adhesive sheet or the like is attached to the surface of the wafer (the surface on which the circuit is formed) to protect the surface. Furthermore, after the back grinding process, the process of peeling a protective sheet from a wafer is performed. [0003] However, wafers that have been extremely thinned by the back grinding process are damaged by microscopic impacts. Therefore, conventionally, there has been proposed a fixing jig for supporting and fixin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6838H01L21/67132Y10T29/49998Y10T156/1132
Inventor 濑川丈士田中清文
Owner LINTEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap