Method for manufacturing circuit board
A manufacturing method and circuit board technology, applied in the direction of electrical connection formation of printed components, etc., can solve problems such as large size differences, poor electrical connection quality between electronic components and circuit boards, and difficult control of electroplating process, etc., to achieve electrical connection quality good effect
Inactive Publication Date: 2012-03-07
UNIMICRON TECH CORP
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Problems solved by technology
However, due to the large size difference between the through hole T and the opening OP, it is difficult to control the electroplating process in the through hole T and the opening OP at the same time, so that the circuit layer 154 tends to have an uneven surface 154a, which will cause Poor electrical connection quality between electronic components and circuit board
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[0023] Figure 2A ~ Figure 2H A cross-sectional view showing a manufacturing process of a circuit board according to an embodiment of the present invention.
[0024] First, please refer to Figure 2A , providing a substrate 210, such as a dielectric substrate or a multi-layer board. A first conductive layer 222 and a third conductive layer 224 are respectively disposed on the two opposite surfaces 212 and 214 of the substrate 210 , wherein the first conductive layer 222 and the third conductive layer 224 are made of a material with good electrical conductivity such as copper. The substrate 210 , the first conductive layer 222 and the third conductive layer 224 may be a copper clad laminate (CCL).
[0025] Next, on the first conductive layer 222 and the third conductive layer 224, a first barrier layer 232 and a second barrier layer 234 are respectively formed, and the method of forming the first barrier layer 232 and the second barrier layer 234 is, for example, sputtering. ...
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A method for manufacturing a circuit board comprises the following steps: firstly providing a substrate with a first conducting layer, secondly forming a barrier layer on the first conducting layer, thirdly forming a through hole which penetrates through the substrate, the first conducting layer and the barrier layer, fourthly forming a second conducting layer on the inner wall of the through hole and the barrier, fifthly removing the part of the second conducting layer, which is positioned out of the through hole, sixthly removing the barrier layer and forming a circuit layer on the first conducting layer and a conducting column and finally removing the part of the first conducting layer, which is exposed out of the circuit layer, wherein the second conducting layer comprises the conducting column arranged in the through hole.
Description
technical field [0001] The present invention relates to a method for making a circuit board, and in particular to a method for making a circuit board with better electrical connection quality with electronic components. Background technique [0002] With the advancement of technology, electronic products such as cellular phones, notebook PCs, and personal digital assistants (PDAs) have been widely used in modern society. Among the necessary parts of these electronic products, in addition to electric devices such as chips and passive components, circuit boards carrying and configuring these chips and passive components are also indispensable and important parts. [0003] The circuit board can be configured with a single layer or multiple circuit layers according to actual needs. When the circuit board has multiple layers of circuit layers, these circuit layers are electrically connected to each other by a plurality of plated through holes (plating through holes). The hole l...
Claims
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IPC IPC(8): H05K3/42
Inventor 石志学罗超鸿徐任辉
Owner UNIMICRON TECH CORP