Breaking strength measuring apparatus and breaking strength measuring method

Abstract

The invention provides a breaking strength measuring apparatus. The breaking strength measuring apparatus can high precisely measure the breaking strength of a measuring object even though under the condition of the development of fragile measuring objects into miniaturization and thinning tendency. The breaking strength measuring apparatus (1) is provided with a loading platform (2) for loading the measuring object (13), a load applicator (a lifting device) (33) for applying load to the measuring object (13), a top pressure piece (14) connected on the load applicator (33) and used for top pressing the measuring object (13), a sensor (12) for detecting change of the measuring object (13) when the measuring object (13) is damaged, and a load detecting unit (32) of the load applied by the top pressure piece (14) when the sensor (12) detects the change of the measuring object (13) subjected to be damaged; the sensor (12) can detect the self-change of the measuring object (13); and elastomers (springs) (21, 22) are inserted between the load applicator (33) and the top pressure piece (14).

Description

technical field [0001] The present invention relates to a breaking strength measuring device and a breaking strength measuring method for measuring the breaking strength of an object to be measured such as a laminated ceramic electronic component. Background technique [0002] In recent years, the miniaturization of electronic devices such as mobile phones has progressed, and accordingly, ceramic electronic components and the like that are also mounted in the electronic devices are also strongly required to be miniaturized or thinned. In recent years, for example, very thin and small ceramic electronic parts having a planar shape of 1.0 mm×0.5 mm and a height of 0.3 mm or less have been developed. [0003] However, ceramic electronic components have a structure in which electrodes are formed on the outer surface and / or inside of a ceramic body. When progressing towards thinning, the ceramic green body will be very thin. Therefore, there is a possibility that cracks may occ...

AI Technical Summary

Problems solved by technology

[0012] However, as described above, with the miniaturization and thinning of ceramic electronic components, when a load is applied from the pressing member 114, the ceramic electronic component as the measurement object 113 will be broken instantly.

Therefore, the gradient of the load application speed at the time of crushing is too steep, and even when ceramic electronic parts in the same state are measured, the measurement results vary widely.

[0013] Additionally, using Figure 11 or Figure 12 In the conventional flexural strength measuring device shown, since the load at the moment of crushing is estimated based on the displacement of the pressing member 114 after the object 113 is crushed, the load applied at the moment the object 113 is actually crushed cannot be accurately measured. load

[0014] Therefore, it is difficult to improve the mounting conditions of ceramic electronic parts and change the strength design of parts with high precision and reliability while promoting miniaturization and thinning

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