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Copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same

A copper alloy, excellent technology, applied in the field of copper alloy materials and its manufacturing, can solve the problems that the material has not yet been developed

Inactive Publication Date: 2010-09-22
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, among these published inventions, a material that simultaneously satisfies yield strength, bending workability, and stress relaxation resistance while reducing strength anisotropy has not yet been developed.

Method used

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  • Copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same
  • Copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same
  • Copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same

Examples

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Embodiment

[0064] Hereinafter, the present invention will be described in more detail based on examples and comparative examples, but the present invention is not limited thereto.

[0065] The copper alloy materials used in Examples and Comparative Examples of the present invention were formed of copper alloys (No. 1 to 30) having the chemical compositions shown in Table 1 (the remainder being Cu). Melt these copper alloys in a high-frequency melting furnace, and cast them into ingots with a thickness of 30mm, a width of 120mm, and a length of 150mm by the DC method. Then, these ingots are heated to 950°C, and after being kept at this temperature for 1 hour, they are hot-rolled. into a thickness of 12mm, and rapidly cooled.

[0066] At this time, in Comparative Example No. 24, the amount of Ni was higher than the specified amount, in Comparative Example No. 25, the amount of S was higher than the specified amount, and in Comparative Example No. 26, the amount of Si was higher than the sp...

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Abstract

Disclosed is a copper alloy material containing 2.8-5.0 mass% of Ni and 0.4-1.7 mass% of Si, while suppressing S content to less than 0.005 mass%. The balance of the copper alloy material is composed of Cu and unavoidable impurities. This copper alloy material has a proof stress of not less than 800 MPa, and is excellent in bending workability and stress relaxation resistance.

Description

technical field [0001] The present invention relates to copper alloy material and its manufacturing method. Background technique [0002] Currently, as materials for electrical and electronic equipment, in addition to iron-based materials, copper-based materials such as phosphor bronze, red copper, and brass, which are excellent in electrical conductivity and thermal conductivity, are widely used. In recent years, the demand for miniaturization and weight reduction of electrical and electronic equipment, and the accompanying high-density mounting have increased, and various performances are also required for copper-based materials that meet these demands. Main properties include mechanical properties, electrical conductivity, stress relaxation resistance, bending workability, and the like. Among them, in order to meet the demand for miniaturization of components in recent years, improvements in tensile strength and bending workability are strongly required. [0003] In add...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22F1/08C22F1/00
CPCC22F1/08C22C9/06
Inventor 广濑清慈三原邦照金子洋江口立彦
Owner FURUKAWA ELECTRIC CO LTD