Packaging structure of surface-mount device infrared receiver

A technology of packaging structure and receiving head, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of expensive raw materials, waste of materials, and high prices of mechanical equipment, and achieve the effect of reducing production costs

Inactive Publication Date: 2010-10-13
陈智军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional infrared patch receiver is mainly encapsulated by plastic mold. The disadvantage of plastic mold packaging is that its raw materials are expensive and need to be imported, and the material waste is serious, the price of mechanical equipment is high, and the production efficiency is low.

Method used

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  • Packaging structure of surface-mount device infrared receiver
  • Packaging structure of surface-mount device infrared receiver
  • Packaging structure of surface-mount device infrared receiver

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] see Figure 1 to Figure 2 , a packaging structure of an infrared patch receiving head, which is mainly composed of a bracket 1, epoxy resin glue 2, a photosensitive receiving diode (not shown), a signal amplification IC (not shown), and an inner shield (not shown) .

[0013] The bracket 1 is mainly composed of a hardware piece 11 and a frame 12 , the frame 12 is made of high temperature plastic or high temperature resin, and the hardware piece 11 is provided with pins 3 .

[0014] The frame 12 is arranged on the hardware sheet 11 and a photosensitive receiving diode, a signal amplifying IC, and an inner shielding sheet mounting hole 4 are arranged in the frame 12 .

[0015] The photosensitive receiving diode and signal amplifying IC are installed in the installation cavity 4, and the interference of light and electrons to the photosensitive receiving diode and signal amplifying IC is shielded through the inner shielding sheet.

[0016] The signal of the photosensitive...

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PUM

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Abstract

The invention relates to a packaging structure of a surface-mount device infrared receiver, which mainly comprises a support, epoxy resin glue, a photosensitive receiving diode, a signal amplification IC and an inner shielding sheet; the support mainly comprises a metal sheet and a frame, the frame is made of high-temperature plastic or high-temperature resin, and the metal sheet is provided with pins; the frame is arranged on the metal sheet, and a mounting socket for the photosensitive receiving diode, the signal amplification IC and the inner shielding sheet is arranged in the frame; the photosensitive receiving diode, the signal amplification IC and the inner shielding sheet are mounted in the mounting socket, and the inner shielding sheet is used for shielding light and electrons from interfering the photosensitive receiving diode and the signal amplification IC; the signals of the photosensitive receiving diode and the signal amplification IC are led out by the pins, and the epoxy resin glue is filled in the mounting socket by a glue dispenser to seal the photosensitive receiving diode, the signal amplification IC and the inner shielding sheet in the mounting socket.

Description

technical field [0001] The invention relates to a package structure of an infrared patch receiving head. Background technique [0002] The infrared receiver is mainly suitable for electrical appliances with remote control. The traditional infrared chip receiver is mainly encapsulated by plastic mold. The disadvantage of plastic mold packaging is that its raw materials are expensive and need to be imported, and the material waste is serious, the price of mechanical equipment is high, and the production efficiency is low. Contents of the invention [0003] The object of the present invention is to provide a packaging structure of an infrared patch receiving head that can greatly reduce production costs. [0004] In order to achieve the above object, the present invention provides a packaging structure of an infrared patch receiving head, which is mainly composed of a bracket, epoxy resin glue, a photosensitive receiving diode, a signal amplifying IC, and an inner shielding ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/14H01L23/29
Inventor 陈智军
Owner 陈智军
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