Pressing wheel mechanism for blanking chip on film

Abstract

The invention provides a pressing wheel mechanism for blanking a chip on film (COF). The pressing wheel mechanism at least comprises a pressing wheel and a pressure device, wherein the pressing wheel is used for rolling and transporting a COF material belt; the pressure device comprises a first movable frame, a second movable frame and a spring; the first movable frame is provided with a plurality of through holes; a plurality of punching shafts positioned in the plurality of through holes move in a vertical direction; the second movable frame is fixedly connected with the first movable frame through the plurality of punching shafts; the second movable frame is fixedly connected with a wheel shaft of the pressing wheel; and the spring is sleeved on the outer surface of one of the plurality of the punching shafts and presses down the second movable frame by using an elastic force of the spring. Due to the adoption of the pressing wheel mechanism for blanking the chip on film, the COF material belt is pressed by a lower pressing force generated by the pressing wheel mechanism after the COF is punched, so that the COF material belt is effectively prevented from being distorted, and the qualification rate of the punched COF is improved. Besides, the pressing wheel mechanism also can reduce the possibility of inconsistent positions of a positioning pin of a punching die and a material belt walking hole of the material belt.

Description

technical field [0001] The invention relates to a manufacturing process of a liquid crystal display, in particular to a blanking process of a chip-on-chip film in the manufacturing process of a thin film transistor liquid crystal display. Background technique [0002] At present, as various electronic products, such as liquid crystal displays, cameras, MP4, inkjet printers, etc., are developing in the direction of small size, light weight, and powerful functions, this technology trend will inevitably promote the development of new packaging technologies. development and utilization. In terms of IC packaging technology for liquid crystal displays, COF (Chip On Film) has been rapidly applied and promoted due to its advantages of high density, small size and free installation, and has gradually become the main driver of LCD ICs. Package form. [0003] Specifically, the COF technology uses a flexible printed circuit film as the carrier of the packaged chip, and the bumps of th...

AI Technical Summary

Problems solved by technology

However, in the COF blanking process, the material strip is often distorted and deformed due to the tension, resulting in the inconsistency between the positioning feet of the stamping die and the position of the strip hole, and in severe cases, the alignment mark may be punched out, so Affects the entire COF packaging technology

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