Unlock instant, AI-driven research and patent intelligence for your innovation.

Guide pin trimming device and module

A technology for trimming devices and guide pins, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of waste, bending and deformation of metal guide pins, and difficulty in use, and achieves the effect of saving costs and improving use efficiency.

Active Publication Date: 2010-11-10
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the metal pins of the dual-in-line package structure are easily bent and deformed by external forces during manufacturing or use, it is often difficult to use even after recycling, resulting in waste

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Guide pin trimming device and module
  • Guide pin trimming device and module
  • Guide pin trimming device and module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more comprehensible, preferred embodiments are specifically cited below and described in detail with the accompanying drawings.

[0027] See first figure 1 , the lead trimming module 10 according to an embodiment of the present invention is mainly used for trimming the metal side pins 22 on both sides of a dual in-line package structure 20 . Such as figure 1 As shown, a groove 23 is formed above the body 21 of the dual-in-line package structure 20, which can be used to accommodate an integrated circuit chip (not shown), and the integrated circuit chip can be connected to each lead 22 through a wire. Electrically conductive for connecting to an external circuit (such as a printed circuit board).

[0028] It should be noted that when the lead 22 of the dual-in-line package structure 20 is deformed or bent due to improper use or collision, it can be corrected by the lead trimmi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides guide pin trimming device and module, wherein the guide pin trimming module is used for trimming a guide pin of a dual in-line type packaging structure and mainly comprises a bearing piece and a movable push handle. The bearing piece comprises a plurality of concave holes which have a gradual contraction structure and are configured in two lines and used for correspondingly accommodating the guide pin. The movable push handle is movably arranged on the bearing piece, positioned between two lines of concave holes, and used for ejecting the dual in-line type packaging structure out of the bearing piece. The guide pin trimming module can correct the guide pin of the dual in-line type packaging structure, generating deformation or bending, to ensure that the guide pin restores the normal state and is recycled.

Description

technical field [0001] The present invention relates to a lead trimming module, in particular to a lead trimming module suitable for a dual-in-line packaging structure, in particular to a lead trimming device and a lead trimming module. Background technique [0002] Dual In-Line Ceramic Package (DIP or Side-braze package) is a common integrated circuit packaging structure. Generally speaking, two rows of metal pins are extended on both sides of the dual-in-line package structure. During assembly, the pins can be soldered to the circuit board to enable electrical conduction between the integrated circuit and the circuit board for normal operation. circuit function. [0003] Since the metal pins of the dual-in-line package structure are easily bent and deformed by external force during manufacture or use, they are often difficult to use even after recycling, resulting in waste. In view of this, how to improve the aforementioned known problems has become an important issue. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/60
Inventor 王玟
Owner VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION