Diaphragm and silicon-based microphone employing diaphragm

A microphone and silicon-based technology, applied in the direction of transducer diaphragm, sensor, electrostatic transducer microphone, etc., can solve the problems of reducing the vibration area of ​​the diaphragm and reducing the sensitivity of the silicon-based microphone, so as to increase the vibration area and improve the sensitivity Effect

Active Publication Date: 2013-03-06
AAC TECH PTE LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The diaphragm of the above structure relatively reduces the vibration area of ​​the diaphragm, thereby reducing the sensitivity of the silicon-based microphone

Method used

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  • Diaphragm and silicon-based microphone employing diaphragm
  • Diaphragm and silicon-based microphone employing diaphragm
  • Diaphragm and silicon-based microphone employing diaphragm

Examples

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Embodiment Construction

[0023] The specific structure of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] First embodiment of the present invention:

[0025] Such as figure 1 As shown, the vibrating membrane 100 of the present invention includes a vibrating part 1, and the vibrating part 1 is provided with at least two grooves 11 recessed from its outer circumference to the center of the vibrating part 1, and the vibrating membrane 100 also includes a self-vibrating Part 1 is connected and partly accommodated in the groove 11. The connecting part 2 and the supporting part 3 connected with the connecting part 2 are provided with a first gap 4 between the supporting part 3 and the vibrating part 1, and the connecting part 2 and the vibrating part 1 A second gap 5 is provided between the grooves 11 . The vibrating part 1 is in a square shape, and the supporting part 3 is also in a square shape and the supporting part 3 completely surrounds...

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PUM

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Abstract

The invention discloses a diaphragm, which comprises a vibrating part. The vibrating part is provided with at least two grooves which recess from the periphery to the center of the vibrating part. The diaphragm also comprises a connecting part and a supporting part, wherein the connecting part is connected with the vibrating part and partially accommodated in the grooves; and the supporting part is connected with the connecting part. A first gap is formed between the supporting part and the vibrating part, and a second gap is formed between the connecting part and the grooves of the vibrating part. The grooves are formed on the vibrating part, the grooves of the vibrating part and the supporting part are connected through the connecting part, the air damping is controlled through the first and second gaps, and the vibrating area of the diaphragm is increased. Therefore, the sensitivity of a silicon-based microphone employing the diaphragm is improved. The invention also provides a silicon-based microphone employing the diaphragm.

Description

【Technical field】 [0001] The invention relates to a vibrating membrane, in particular to a vibrating membrane applied to a silicon-based microphone. 【Background technique】 [0002] With the development of wireless communication, there are more and more mobile phone users around the world. The requirements of users for mobile phones are not only satisfied with calls, but also to be able to provide high-quality call effects. Especially the current development of mobile multimedia technology, the mobile phone Call quality is more important. The microphone of a mobile phone is used as a voice pick-up device for the mobile phone, and its design directly affects the call quality. (Micro-Electro-Mechanical-System Microphone, MEMS for short), in related technologies, a silicon-based microphone includes a substrate, a back plate and a diaphragm. The diaphragm is an important part of the silicon-based microphone, which includes a vibrating part and a supporting part extending from th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R7/00H04R19/04
Inventor 杨斌
Owner AAC TECH PTE LTD
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