Film-coating device

Abstract

A magnetron sputtering device includes a target holder, a substrate holder, and a first driver. The target holder defines a sputtering space therein, and includes at least one target tray arranged at a periphery of the sputtering space. The substrate holder is rotatably positioned in the sputtering space. The first driver is connected to the substrate holder. The first driver is operable to rotate the substrate holder relative to the target holder.

Description

technical field [0001] The invention relates to a coating device. Background technique [0002] The sputtering device usually sets the substrate to be plated opposite to the target, and uses plasma to bombard the target, so that the atoms of the target are sputtered onto the substrate under the action of the plasma to form a film layer. The current sputtering device generally fixes the target, and the substrate to be plated can translate relative to the target, but cannot rotate relative to the target. When the shape of the substrate to be plated is relatively complex, the cross-sectional area of ​​some surfaces to be plated on the substrate to be plated relative to the target plane is relatively small, so the film layers plated on these surfaces to be plated are larger than those on other surfaces. Thin, resulting in uneven thickness of the coating layer on the substrate to be coated. Contents of the invention [0003] In view of this, it is necessary to provide a coati...

AI Technical Summary

Problems solved by technology

When the shape of the substrate to be plated is relatively complex, the cross-sectional area of ​​some surfaces to be plated on the substrate to be plated relative to the target plane is relatively small, so the film layers plated on these surfaces to be plated are larger than those on other surfaces. Thin, resulting in uneven thickness of the coating layer on the substrate to be coated

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