Circuit substrate module with heat radiator and production method thereof
A technology of circuit substrate and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, circuit, cooling/ventilation/heating transformation, etc., and can solve the problems affecting the joint reliability and aging of the circuit board 92 and the bearing seat 941, so as to improve heat dissipation Efficiency, reduce thermal impedance, increase heat dissipation effect
Inactive Publication Date: 2010-12-08
TONG HSING ELECTRONICS INDS
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Problems solved by technology
Moreover, the solder or heat-conducting glue 93 connecting the circuit board 92 and the bearing seat 941 is also prone to aging due to the high temperature environment, which affects the joint reliability of the circuit board 92 and the bearing seat 941, and there is also a need for improvement.
Method used
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[0037] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0038] Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.
[0039] Such as Figure 2a to Figure 2c , image 3 and Figure 4 As shown, the first preferred embodiment of the manufacturing method of the circuit substrate module with the radiator and the circuit substrate module with the radiator of the present invention is described.
[0040] The implementation steps of the first preferred embodiment are described as follows.
[0041] refer to Figure 2a to Figure 2c , to illustrate the implementation steps of preparing the circuit substrate 10 . Such as Figure 2a As shown, first take a double-sided copper-clad ceramic board 1, that is, the middle is a ceramic layer 11 and both sides of the ceramic layer 11 are covered with copper l...
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The invention discloses a circuit substrate module with a heat radiator and a production method thereof. A circuit substrate is jointed with a bearing seat of the heat radiator and is made of a two-sided copper-coated ceramic plate; a circuit pattern is formed on a copper layer on one side of the circuit substrate; a plurality of first positioning parts are formed on the copper layer on the otherside of the circuit substrate; a plurality of second positioning parts are formed on the bearing seat, wherein the second positioning parts are in one-to-one correspondence with the first positioningparts; the circuit substrate and the bearing seat are oppositely positioned through corresponding first positioning parts and second positioning parts and are subject to the heat treatment; and the circuit substrate is jointed with the bearing seat, so that the circuit substrate is fixed on the bearing seat. The invention can not only reduce the thermal impedance, but also can greatly improve theheat-radiating efficiency, so that the circuit substrate and the heat radiator are favorably and reliably jointed.
Description
technical field [0001] The invention relates to a method for manufacturing a circuit substrate module with a radiator, in particular to a method for manufacturing a circuit substrate module with a radiator in which the circuit substrate and the radiator are fixed by sintering and the circuit substrate produced therefrom mod. Background technique [0002] In order to improve the efficiency of electronic components, more and more electronic components are developing towards high power, such as high brightness light-emitting diodes (High Brightness LED), concentrating solar cells, insulated gate bipolar transistors (Insulated Gate Bipolar Transistor, IGBT), etc. . [0003] Since high-power electronic components usually generate a large amount of heat during operation, if the heat energy cannot be removed in a timely manner, the performance of the electronic components will be damaged. Therefore, high-power electronic components need to be equipped with a heat sink to dissipat...
Claims
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Login to View More IPC IPC(8): H01L21/48H01L23/14H01L23/13H01L23/498H01L23/34H05K7/20
CPCH01L2224/48091H01L2924/1305H01L2924/13055
Inventor 江文忠吴耿忠谢英基吕政刚傅铭煌
Owner TONG HSING ELECTRONICS INDS