Triode lead frame and manufacturing method thereof
A lead frame and triode technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems affecting the performance of components, leading to the actual effect of electronic products, and poor heat dissipation of chips, so as to save materials , high-efficiency heat dissipation, and simple manufacturing process
Inactive Publication Date: 2011-01-05
吴江恒源金属制品有限公司
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Problems solved by technology
[0002] The thickness of the chip part of the lead frame in the prior art is equal to the thickness of each pin and the thickness of the heat dissipation part, so that the heat dissipation effect of the chip is not good, directly affects the performance of components, and may even lead to the actual effect of electronic products.
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[0022] The technical scheme of the present invention is described in detail below in conjunction with the embodiment shown in the accompanying drawings:
[0023] as attached figure 1 As shown, the triode lead frame of the present invention includes several frame units, and each frame unit is connected through the middle rib 1 and the bottom rib 2, and each frame unit includes a chip part 3, and is connected to the upper end of the chip part 3 through a through hole 8 The heat dissipation part 4, the middle pin 5 connected to the lower end of the chip part 3, the first side pin 6 and the second side pin 7 respectively located on the left and right sides of the middle pin, the lower end of the middle pin 5, the first The lower end of the side pin 6 and the lower end of the second side pin 7 are all connected to the bottom rib 2, the lower end of the middle pin 5, the lower end of the first side pin 6 and the lower end of the second side pin 7 Both are 60° sharp angles, the midd...
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The invention discloses a triode lead frame and a manufacturing method thereof. The lead frame comprises a plurality of frame units, the adjacent frame units are connected to each other by an intermediate rib and a bottom rib; each frame unit comprises a chip part, a heat radiating part connected to the upper part of the chip part, an intermediate pin connected to the lower part of the chip part, a first side pin and a second side pin arranged on the left side and the right side of the intermediate pin; the thicknesses of the heat radiating part, the intermediate pin, the first side pin and the second side pin are all less than the thickness of the chip part; the chip part is provided with V-shaped grooves distributed in a U form; and the lead frame is made of a profiled bar by integral molding. The chip is more firmly welded on the lead frame and stressed more intensively; heat can be efficiently radiated; and the performances of the chip are ensured. The lead frame is inserted into a circuit board with time saving and labor-saving; the production process is simple, easily feasible and suitable for popularization and use.
Description
technical field [0001] The invention relates to a semiconductor discrete device, in particular to a triode lead frame and a manufacturing method thereof. Background technique [0002] In the prior art, the thickness of the chip portion of the lead frame is equal to the thickness of each pin and the thickness of the heat dissipation portion, so that the heat dissipation effect of the chip is not good, directly affects the performance of components, and may even lead to the effectiveness of electronic products. Contents of the invention [0003] The object of the present invention is to provide a triode lead frame with good heat dissipation performance and a manufacturing method thereof. [0004] In order to solve the problems of the technologies described above, the present invention adopts the following technical solutions: [0005] A triode lead frame, comprising a plurality of frame units, each of the frame units is connected through middle ribs and bottom ribs, each fr...
Claims
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IPC IPC(8): H01L23/495H01L21/48
Inventor 杨承武钟俊东陈庆麟刘亮
Owner 吴江恒源金属制品有限公司