Method for manufacturing double diffusion type optical avalanche diode with incident light on back surface by adopting epitaxial equipment
A double-diffusion and avalanche tube technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of PN junction interface depression, impossibility of doping, and slow diffusion rate, so as to reduce series resistance, suppress surface electric field, and avoid absorption effect
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[0031] The invention adopts MOCVD epitaxy equipment to carry out primary epitaxy of avalanche photodiode on indium phosphide substrate, adopts MOCVD epitaxy equipment double-diffusion mode diffusion method to do doping and sputter P surface electrode, substrate is thinned, and light entrance hole on the back Wet etching, growing anti-reflection layer, making N-side electrode and electrode alloying.
[0032] The present invention will be described in detail below with reference to the accompanying drawings.
[0033] The primary epitaxy of the avalanche photodiode is carried out on the indium phosphide substrate by MOCVD, and the epitaxy is composed of seven layers (see figure 1 ), from bottom to top are S-doped N-type indium phosphide substrate 1, 1 micron N-type indium phosphide buffer layer 2, 2 micron doping concentration of i-type indium gallium arsenic absorber layer of 1E15cm^(-3) 3. 0.2 micron N-type indium phosphide layer 4, 0.12 micron InGaAsP gradient layer 5, 0.4 mi...
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