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Environment-friendly lead-containing solder capable of inhibiting lead from volatilizing at high temperature in electronic industry
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An environmentally friendly technology in the electronics industry, used in manufacturing tools, welding/cutting media/materials, welding media, etc., to achieve the effects of good environmental conditions, low cost, and safe and convenient use
Inactive Publication Date: 2013-03-06
CHONGQING UNIV OF TECH
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This covering agent is mainly used for lead bath quenching of steel wire, not suitable for electronic brazing
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Embodiment 1
[0024] Example 1: Put 630g of Sn and 370g of Pb in an open electric furnace for oxidation refining and boiling refining, then pour into a closed converter, add 0.5g of Al, 0.01g of Ni, and 0.005g of Ga for modification and refining, and the obtained The solder is heated to 800°C at a rate of 10°C per minute under a protective atmosphere, and it is measured that the volatilization of lead is 65% lower than that of Sn-37Pb.
Embodiment 2
[0025] Example 2: Put 620g of Sn, 360g of Pb, and 20g of Ag in an open electric furnace for oxidation refining and boiling refining, then inject into a closed converter, add 0.1g of Al, 1.5g of Bi, and 0.05g of In to improve The resulting solder is heated to 800°C at 10°C per minute under a protective atmosphere, and the measured lead volatilization is 72% lower than that of Sn-37Pb.
Embodiment 3
[0026] Example 3: Put 550g of Sn, 430g of Pb, and 20g of Sb in an open electric furnace for oxidation refining and boiling refining, then inject into a closed converter, add Ni 0.5g, P 0.05g, and Ti 0.005g to improve The resulting solder is heated to 800°C at 10°C per minute under a protective atmosphere, and it is difficult to detect the volatilization of lead.
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Abstract
The invention provides an environment-friendly lead-containing solder capable of inhibiting lead from volatilizing at high temperature in the electronic industry, which consists of the following components in percentage by weight: 0 to 4.0 percent of Ag, 0 to 3.0 percent of Sb, 0.0001 to 0.2 percent of one or more of Ni, Al, Bi, Ga, In, P and Ti, and the balance of Sn and Pb, wherein the sum of the Ni, Al, Bi, Ga, In, P, Ti and other elements is not more than 0.3 weight percent at most; and there are various better combinations, such as the combination of Ni and P, the combination of Ni, P and Ti, and the combination of Ni, P and Ga, or Ni, Al and the like are selected only. After the solder is fused, the solder can automatically form a layer of surface modification film to obviously inhibit the lead from volatilizing at high temperature; in the using process, environmental conditions are good, and the solder does not influence the health of operators, is safe and convenient to use, and has low cost; therefore, the solder is a new-generation micro-jointing material used for manufacturing electronic products in an environment-friendly way.
Description
[0001] The present invention is a divisional application of the invention patent application with application number 200810069745.8. technical field [0002] The invention relates to a lead-containing solder used in the electronics industry to inhibit lead from volatilizing and polluting the environment at high temperatures. Background technique [0003] For a long time, lead-containing solder has been widely used as electronic soldering material due to its low cost and excellent performance. Since lead pollutes the environment, the world has started research on lead-free electronic solder since the 1990s, but up to now, a kind of lead-free solder with comprehensive performance comparable to that of Sn-Pb solder has not been found, and there is no Find a comprehensive solution to replace Pb. In many electronic devices, it is difficult to truly realize lead-free because the reliability of lead-free solder cannot be guaranteed. Therefore, in the future, electronic solder wil...
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