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Apparatus and method for mounting FPD board

A technology of FPD board and installation device, which is applied to identification devices, optics, instruments, etc., can solve the problems of increased usage of cleaning tapes, dust removed from the front side re-attaching to the back side, glass sheets scratching the back side, etc., to avoid problems such as The effect of reducing the installation yield and avoiding the increase in the processing cost

Inactive Publication Date: 2011-03-30
HITACHI HIGH-TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, since the cleaning tape that has been wiped on the front side is in contact with the back side during the next wiping, the dust removed from the front side may be attached to the back side again.
Moreover, in this method, the edge portion of the glass substrate may be scratched by the cleaning tape, and if the end portion of the glass substrate is not sufficiently chamfered, there is a risk that the back surface may be scratched by the glass piece falling off from the end portion.
In order to avoid this danger, there is a method of not using a cleaning tape that may be contaminated by dust on the surface and glass pieces at the end by sending the cleaning tape redundantly, but there is a problem that the usage amount of the cleaning tape increases

Method used

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  • Apparatus and method for mounting FPD board
  • Apparatus and method for mounting FPD board
  • Apparatus and method for mounting FPD board

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Embodiment Construction

[0024] Below, use Figure 1 to Figure 4 One embodiment of the present invention will be described.

[0025] figure 1 It is a floor layout diagram showing the whole display substrate module assembly line 1 according to the embodiment of the present invention, figure 2 It is a perspective view which shows the appearance of the terminal cleaning head which concerns on 1st Embodiment of this invention.

[0026] figure 1 The device is a conveying device composed of a substrate holding mechanism 12 for holding a substrate P and a conveying arm 11 for conveying the substrate to an adjacent mounting device position. While conveying the substrates sequentially from left to right in the figure, the substrate A mounting line device that performs various processing operations on the peripheral part of the IC and TAB, etc., for mounting and assembly operations, figure 1 (a) means the first half, figure 1 (b) shows the second half. It is actually the connecting installation line, but...

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Abstract

The present invention relates to an apparatus and method for mounting a FPD board. Due to thinness of a FPD display substrate and high precision of joint processing, a frequency that a foreign body attached to a back face of the substrate is an imperfect cause is high. The previous back face cleaning is that the back face is cleaned by a cleaning belt which surface is cleaned, dust and glass sheet can be attached to the surface again. In a process of loading and joining elements of a display device, dust and stain attached to a terminal part of the display substrate is cleaned by the surface of the cleaning belt, simultaneously, the back face of the terminal part of the display substrate is cleaned by the back face of the cleaning belt which has been used for cleaning the terminal part of another display substrate. Thus, there is non consideration that dust and glass sheet can be brought from the surface to be attached to the back face of the display substrate.

Description

technical field [0001] The present invention relates to loading driver ICs on the periphery of FPD (Flat Panel Display, flat panel display) display substrates such as liquid crystal or plasma, and performing COF (Chip On Film, chip-on-film), FPC (Flexible Printed Circuit, flexible printed circuit board) and other so-called The TAB (Tape Automated Bonding, tape automatic welding) connection and installation of the surrounding substrate (PCB, Printed Circuit Board, printed circuit board) mounting device and the substrate module assembly line composed of these. More specifically, it relates to, for example, a mounting device and mounting method equipped with a substrate cleaning mechanism suitable for processing of loading TABs and ICs, and a display substrate module assembly line or display substrate module assembly method configured based on the mounting device or mounting method. Background technique [0002] The display substrate module assembly line is to sequentially perf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13H01J17/49G09F9/30
Inventor 大录范行平迫弘司儿玉正吉
Owner HITACHI HIGH-TECH CORP
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