Flex-rigid wiring board and method of manufacturing the same

A rigid-flexible combination and manufacturing method technology, applied in printed circuit manufacturing, multilayer circuit manufacturing, printed circuit and other directions, can solve the problems of wiring short circuit or open circuit, affecting the insulation of the flexible part A, and reducing the quality, so as to protect the flexible part Effect

Inactive Publication Date: 2011-03-30
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the quality decreases due to the dissolution of the base film 4 of the flexible part A, the insulation of the flexible part A will also be affected, and problems such as wiring short circuit or disconnection caused by the copper foil will easily occur.

Method used

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  • Flex-rigid wiring board and method of manufacturing the same
  • Flex-rigid wiring board and method of manufacturing the same
  • Flex-rigid wiring board and method of manufacturing the same

Examples

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Embodiment Construction

[0034] Below, according to figure 1 , figure 2 An embodiment of the rigid-flex circuit board of the present invention will be described. The structure of the rigid-flex circuit board 22 of this embodiment is integrally formed continuously: a soft flexible part A, and a rigid part B on which electronic parts are mounted and has rigidity. In the central portion of the rigid-flex circuit board 22, a base film 24 such as polyimide with a thickness of, for example, an insulating layer of about 10 to 50 μm is provided as a core base material, and a few μm to several tens of μm are attached to both sides thereof. The copper foil 26 of the conductor layer, thereby forming the copper clad laminate 20.

[0035] A predetermined circuit pattern 28 is formed on one surface of the copper-clad laminate 20, and a wiring layer is formed using copper foil, and a cover film 32 of an insulating layer is further laminated. The cover film 32 is formed of, for example, polyimide, is about ten t...

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PUM

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Abstract

Provided is a flex-rigid wiring board wherein a resin weak to chemicals is surely protected without increasing man-hour during a manufacturing step. A method for manufacturing such flex-rigid wiring board is also provided. The flex-rigid wiring board is composed of a flexible section (A) having a base film (24), i.e., an insulating layer, and a copper foil (26), i.e., a conductor layer; and a rigid section (B), which is integrally arranged with the flexible section (A) and has circuit patterns (28, 29). One surface of the base film (24) of the flexible section (A) is entirely covered with the copper foil (26). The copper foil (26) is removed when etching is performed in an intermediate processing step. At the boundary between the flexible section (A) and the rigid section (B), a part extending from the removed copper foil (26) is embedded in the rigid section (B).

Description

technical field [0001] The present invention relates to a rigid-flex circuit board having a flexible cable portion integrally extended from a mounting portion on which various electronic circuits are formed, and a method for manufacturing the same. Background technique [0002] Conventionally, flexible wiring boards having a structure in which necessary wiring patterns are formed on the surface of an insulating film have been used in various devices. Especially in recent years, a rigid-flex circuit board in which a flexible cable portion extends from a rigid mounting portion on which an electronic circuit is formed has been widely used in various electronic devices. [0003] as the first image 3 As shown, the rigid-flexible circuit board 2 is integrally formed with: a flexible part A with cables laid on the inside and a rigid part B with circuits or electronic components installed, and its structure is continuously extended from the flexible part A to the rigid part B The ...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K2203/0554H05K2203/1388H05K2201/09781H05K3/0055H05K3/4691H05K3/4652H05K3/0035
Inventor 浦辻淳广
Owner DEXERIALS CORP
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