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Integrated high-power light-emitting diode (LED) lens and lamps thereof

A technology of LED lenses and LED lamps, which is applied in the direction of lenses, lighting and heating equipment, instruments, etc., can solve the problems of inability to apply high-power LEDs and small light-emitting surface area, so as to prevent damage to human eyes, expand application fields, The effect of preventing light pollution

Active Publication Date: 2015-01-28
SICHUAN SUNFOR LIGHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, integrated high-power LEDs in multi-chip packages are being widely used due to their low cost. Commonly used single-chip packaged LEDs have a small light-emitting surface area of ​​1X1 mm. Using this single-chip packaged LED light distribution design The lens cannot be applied to high-power LEDs in multi-chip integrated packages

Method used

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  • Integrated high-power light-emitting diode (LED) lens and lamps thereof
  • Integrated high-power light-emitting diode (LED) lens and lamps thereof
  • Integrated high-power light-emitting diode (LED) lens and lamps thereof

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Embodiment Construction

[0021] Such as figure 1 As shown, the lens of the present invention includes a light incident surface 1 , a light exit surface 2 and an annular reflective surface 3 . The light-incident surface 1 faces the light-emitting surface of the LED, and the light-emitting surface 2 intersects with the annular reflective surface 3, and the annular reflective surface 3 constitutes a reflective cup. The light-incident surface 1 , the light-exit surface 2 and the annular reflective surface 3 are axisymmetric, and the light-emitting surface of the multi-chip package integrated high-power LED 4 faces the light-incidence surface 1 . The light incident surface 1 is a quadratic curved surface, and its surface coefficient is: K=-1.2~-1.5, R (half warp, the same below)=35~41mm; the light exit surface 2 is a plane; the reflective surface 3 It is a quadratic surface, and its surface coefficient is: K=-0.24~-0.26, R=23~29 millimeters.

[0022] In the present invention, the above-mentioned multiple...

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Abstract

The invention provides a high-power light-emitting diode (LED) lens packaged by integrating a plurality of LED chips and lamps of the LED lens. The integrated high-power LED lens comprises a light-entering surface, a light-emitting surface and an annular reflecting surface, wherein the light-emitting surface penetrates through the annular reflecting surface; the light-entering surface is a quadratic surface of which the curve coefficients are as follows: K is from -1.2 to -1.5 and R is equal to 35-41mm; the light-emitting surface is a plane; and the annular reflecting surface is a quadratic surface of which the curve coefficients are as follows: K is from -0.24 to -0.26 and R is equal to 23-29mm. The lens of the invention adopts reasonable shapes of the light-entering surface and the light-emitting surface, and combines with the annular reflecting surface; the lights from the LED center region emit through the light-emitting surface, and the lights from the LED edge emit through the annular reflecting surface, thus the loss of LED optical energy can be avoided due to the limited angle of the viewing filed of the lens, thereby maximally collecting the lights from the LED and improving the luminous efficiency of the lamps.

Description

technical field [0001] The invention relates to an LED lamp, in particular to a multi-chip packaged integrated high-power LED lens and the lamp. Background technique [0002] Compared with traditional light sources, LED has the advantages of high luminous efficiency, good color rendering, low power consumption, energy saving and environmental protection, high safety and reliability, and long service life. The main direction, with huge market potential. At present, integrated high-power LEDs in multi-chip packages are being widely used due to their low cost. Commonly used single-chip packaged LEDs have a small light-emitting surface area of ​​1X1 mm. Using this single-chip packaged LED light distribution design The lens cannot be applied to high-power LEDs in multi-chip integrated packages. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a high-power LED lens and a lamp for integrated packaging of multiple LED c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B3/00F21V5/04F21V17/00F21V7/04F21S8/00F21V19/00F21Y101/02
CPCF21S8/00F21V5/04F21V7/04F21V17/00F21V19/001
Inventor 宋春发张明李林春
Owner SICHUAN SUNFOR LIGHT