High-temperature three-dimensional digital image related measurement system and measurement method

Abstract

The invention discloses a high-temperature three-dimensional digital image related measurement system and a high-temperature three-dimensional digital image related measurement method. The system comprises a digital camera, an imaging lens, band-pass optical filter, a monochromatic light source, a calibration board, a support system and a computer, wherein the support system consists of a triangular bracket, a guide rail and a translation stage; and the computer is used for acquiring a digital image and performing analysis processing. The measurement method comprises five steps. In the system, the band-pass optical filter is arranged in front of the imaging lens of the digital camera, so that the influence of the thermal radiation of a high-temperature object on the brightness enhancement of an acquired image of the camera can be reduced effectively. In the measurement, a measured object is lighted by adopting the monochromatic light source of which the lighting wavelength is positioned in a band-pass range of the band-pass optical filter. By using the system and the method, a brilliant image of the surface of the high-temperature object at the surface temperature of over 500 DEG C is acquired, wherein the image can be directly analyzed and processed by a three-dimensional digital image related method to acquire the three-dimensional morphology of the surface of the high-temperature object and a three-dimensional deformation field under the action of a thermal load. The system has a compact structure, is convenient to operate, and has a wide application range and high measurement precision.

Description

technical field [0001] The invention relates to a high-temperature three-dimensional digital image correlation measurement system and its measurement method for measuring the three-dimensional shape of the surface of a high-temperature object and the full-field three-dimensional deformation under the action of force and thermal load, and belongs to photomechanics, mechanical performance testing of engineering materials, Component deformation and displacement testing technology and other fields. Background technique [0002] In recent years, with the rapid development of aerospace, energy engineering and other fields, various materials are more and more widely used in high temperature environments. For example, hypersonic aircraft materials, components in aero-engines, high-pressure steam boilers, high-temperature pipes in power plants, steam turbines, and many materials and components in chemical oil refining equipment require a certain period of time or long-term work in hi...

AI Technical Summary

Problems solved by technology

This de-correlation effect will lead to the failure of matching algorithms in existing 3D digital image correlation methods

Due to the inherent defects of ordinary optical imaging systems, the current 3D digital image correlation method cannot perform non-contact, high-precision measurement of the 3D topography of the surface of a high-temperature object with a surface temperature higher than 500 °C and the 3D deformation field under the action of force and thermal load.

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